Substrate coated with silica-containing film with...

Stock material or miscellaneous articles – Composite – Of silicon containing

Reexamination Certificate

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C257SE21242, C257SE21261

Reexamination Certificate

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06893726

ABSTRACT:
A coating liquid for forming a silica-containing film with a low-dielectric constant which enables formation of low-density film having a dielectric constant as low as 3 or less and having excellent resistance to oxygen plasma and process adaptation but also in the adhesion to a substrate and film strength. A substrate coated with the silica-containing film having the above characteristics, obtained by the use of the above coating liquid. The coating liquid for forming a silica-containing film with a low-dielectric constant comprises a polymer composition mainly constituted by a polysiloxane and a readily decomposable resin, said polysiloxane being a reaction product between fine particles of silica and a hydrolyzate of at least one alkoxysilane represented by the following formula (I): XnSi(OR)4-n, wherein X represents a hydrogen atom, a fluorine atom, an unfluorinated or fluorinated alkyl group of 1 to 8 carbon atoms, an aryl group or a vinyl group; R represents a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group or a vinyl group; and n is an integer of 0 to 3.

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patent: 6001522 (1999-12-01), Woo et al.
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patent: 0 145 308 (1985-06-01), None
patent: 0 767 467 (1997-04-01), None
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patent: 9735939 (1997-02-01), None

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