Apparatus for reflow soldering

Details Apparatus for reflow soldering Apparatus for reflow soldering

1990-11-19

1992-07-14

Evans, Geoffrey S.

Electric heating

Metal heating

For bonding with pressure

219 8518, B23K 3047

Patent

active

051305097

ABSTRACT:
A solder reflow apparatus for securing a plurality of aligned juxtaposed electronic components of various kinds to a solder-clad metal strip, wherein the substrate of the clad metal strip defines a conductive medium which is electrically heated to a proper temperature to allow the solder thereon to melt and reflow so as to cover the wire leads of each component as they lie across the solder-clad surface metal substrate. The apparatus comprises a base member having a pair of electrodes to which the metal-clad strip is releasably attached. A clamping framework is hingedly supported on the work surface of the base member and is arranged to be lowered over the lead wires of the electronic components that are in contact with the solder-clad surface of the substrate. Electric power is provided through the electrodes to the substrate by means of a suitable low voltage, high-current power supply having a timing system that establishes the proper melting temperature and timing to provide a perfect bonding between the components and the substrate material.

REFERENCES:
patent: 2332368 (1943-10-01), Burtenshaw
patent: 3778581 (1973-12-01), Denny
patent: 4220845 (1980-09-01), Morreale

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