Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2002-11-25
2004-11-23
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S098000, C257S100000
Reexamination Certificate
active
06822269
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a light emitting diode (LED) device used in electronic devices such as a portable telephone.
FIG. 6
is a sectional view of a conventional LED device. The LED device
70
comprises a frame
71
made of resin and having a truncated cone recess
57
, electrodes
72
a
and
72
b
embedded in the frame
71
, and an LED
54
secured to the electrode
72
a.
The LED
54
is connected to the electrode
72
b
by a lead wire
55
. The inside wall of the recess
57
is processed into a light reflection surface. The recess
57
is charged with a transparent resin
56
to seal the LED.
In the LED device
70
, if moisture remains in the transparent resin
56
, the frame
71
is cracked by expansion of the moisture caused by the heat of the reflow soldering. Furthermore, the transparent resin
56
contracts in dependency on the change of the atmospheric temperature. If the change repeats, lead wire
55
may be cut, which results in unreliableness of the device.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a light emitting diode device.
According to the present invention, there is provided a light emitting diode device comprising a body having a recess, the body comprising a pair of half bodies made of metal, an insulation layer provided between the half bodies, an LED provided on a bottom of the recess, connecting means for connecting the LED with the half bodies, a sealing resin for sealing the connecting means and a transparent sealing plate for closing the recess.
The recess is formed into a semispherical shape or an inverted truncated cone.
The sealing plate has a convex lens, and the connecting means are bumps.
Furthermore, there is provided a method for manufacturing a light emitting diode device comprising the steps of preparing a body assembly having a plurality of LED device areas formed by pressing a metal plate, forming a recess in each of the LED areas, forming slits in areas arranged on a predetermined line except both side edges, charging a resin in each slit, mounting an LED on a bottom of the recess by bumps, charging a sealing resin under the LED, securing a transparent sealing plate on the body assembly, and dividing each area from the body assembly.
These and other objects and features of the present invention will become more apparent from the following detailed description with reference to the accompanying drawings.
REFERENCES:
patent: 4529907 (1985-07-01), Nagasawa
patent: 6054716 (2000-04-01), Sonobe et al.
patent: 6340824 (2002-01-01), Komoto et al.
patent: 6452217 (2002-09-01), Wojnarowski et al.
patent: 6597019 (2003-07-01), Inoue et al.
Horiuchi Megumi
Michino Takayoshi
Citizen Electronics Co. Ltd.
Dennison Schultz Dougherty & MacDonald
Jackson Jerome
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