Low power schottky emitter

Electric lamp and discharge devices – Electrode and shield structures – Point source cathodes

Reexamination Certificate

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C313S271000, C313S318010

Reexamination Certificate

active

06771013

ABSTRACT:

TECHNICAL FIELD OF THE INVENTION
The present invention relates to the field of thermal field emission sources and, in particular, to a compact, low input power consumption thermal field emitter.
BACKGROUND OF THE INVENTION
Electron emission cathodes, also referred to as electron emitters or electron sources, are used in devices such as scanning electron microscopes, transmission electron microscopes, semiconductor inspection systems, and electron beam lithography systems. In such systems, an electron source provides electrons, which are then guided into an intense, finely focused beam.
One type of electron source widely used in modern electron beam systems is the thermal field emission cathode, which uses a combination of heat and electric field to emit electrons. One type of thermal emission cathode is a Schottky emission cathode, commonly referred to as a Schottky emitter. (Although the term “Schottky emission” refers to a specific operating mode of an emitter, the term “Schottky emitter” is used more broadly to describe a type of electron emitter that may be capable of operating in a variety of modes, including a Schottky emission mode.) A Schottky emitter uses a very thin coating on a heated emitter tip to reduce its work function, that is, the energy required to free an electron from the emitter surface.
FIG. 1
shows part of a typical prior art Schottky emitter
12
, such as the one described in U.S. Pat. No. 3,814,975 to Wolfe et al. for “Electron Emission System.” Schottky emitter
12
includes a polycrystalline tungsten, hairpin-shaped filament
14
that supports and heats an emitter
16
having an apex
22
from which the electrons are emitted. Applicants herein use the term “emitter” alone to refer to that portion of the electron source from which electrons are emitted (e.g., emitter
16
of
FIG. 1
) and the terms “Schottky emitter” and “thermal field emitter” to refer to the entire electron source assembly (e.g., Schottky emitter
12
). Heating current is supplied to filament
14
through filament posts
26
, typically composed of molybdenum, kovar, or tungsten and extending through both sides of a base
28
. Filament posts
26
are typically inserted through close-fitting holes
30
in base
28
and secured by brazing. Schottky emitter
12
typically operates with apex
22
at a temperature of between 1,700 K and 1,900 K, most typically at around 1,800 K. A suppressor cap
32
is typically press fitted onto base
28
and extends out to near the emitter apex
22
to reduce the undesirable emission of electrons from the shank of the emitter.
Emitter
16
is typically made from a single crystal of tungsten oriented in the <100> direction and coated with a coating material, such as zirconium and oxygen, to lower the work function of the emitter tip by approximately 1.5 electron volts. At the high temperatures at which Schottky emitter
12
operates, the coating material tends to evaporate from emitter
16
and must be continually replenished to maintain the lowered work function at apex
22
. A reservoir
34
of the coating material is typically provided to replenish the coating on emitter
16
. The material from reservoir
34
diffuses along the surface and through the bulk of emitter
16
toward apex
22
, thereby continually replenishing the coating there. The input power required to heat a Schottky emitter is substantial, typically somewhat greater than 2 watts.
As electron beam instruments become more accepted in production environments as inspection and processing tools, users demand increased throughput. One method of increasing speed entails incorporating several electron beams into a single system. In such systems, the heat conducted and radiated from multiple thermal field emitters is additive and could produce an overall system temperature that would be unacceptably high and can cause drift in the emitter position. Another trend in electron beam instruments is miniaturization. Smaller instruments cost less to construct, take up less space in a production area, and are more mobile. Smaller instruments are particularly well suited for production applications, such as electron beam lithography for forming microscopic structures in integrated circuit assembly. For example, U.S. Pat. No. 6,218,664 to Krans et al. describes an electrostatic objective lens and electrical scanning device that can be used in a very small electron beam system.
It is desirable to reduce the size and power consumption of thermal field emitters to allow construction of smaller electron beam systems and to fit more electron columns within a system requiring the use of multiple emitters. Because of the small volume and dense packing of components in such systems, it is desirable to reduce not only the size of the thermal field emitter, but also the power consumption and the heat output of the thermal field emitter or emitters. The great amount of heat produced by the multiple closely packed thermal field emitters can adversely affect the operation of the electron columns.
One method of reducing the undesirable heat conducted and radiated into the electron column from a thermal field emitter is to use a substantial quantity of a thermally conductive material attached to the base and filament posts to provide a path to conduct excess heat away from the source. Unfortunately, cooling the base or the filament posts tends to cool the emitter assembly as well, and so has the undesirable effect of increasing the input power required to maintain emitter apex
22
at an acceptable operating temperature.
SUMMARY OF THE INVENTION
An object of the invention is to provide an electron source having reduced input power consumption.
An aspect of the invention includes providing an electron source having reduced thermal losses.
Yet another aspect of the invention includes providing a compact electron source.
Still another aspect of the invention includes providing a thermal field electron source having reduced input power consumption and reduced thermal losses.
Yet a further aspect of the invention includes providing an electron beam system that uses multiple low power electron sources.
Still a further aspect of the invention includes providing a compact electron beam instrument that uses a low power electron source.
The present invention comprises a thermal field emitter that is compact and that consumes less input power than a typical prior art emitter for a comparable emitter operating temperature. The invention maintains the emitter tip at the optimum operating temperature while reducing heat losses in the thermal field emitter, particularly heat losses through the base. The inventive emitter has a base that has a sufficient external area for attaching a suppressor cap and for attaching the complete thermal emitter assembly to its holder, yet it has a reduced thermal path between the filament posts and the base, thereby reducing heat transfer. Because heat transfer to the base is reduced, less power is required to maintain the emitter tip at operating temperature, so less electrical current is required to heat the filament. The filament and filament posts can be constructed from preferred materials that were not used with prior art thermal field emitters.
The thermal field emitter includes a heating filament in thermal contact with an emitter; filament posts in electrical contact with the heating filament to provide electrical current to heat the filament; and a base supporting the filament posts, the base having an outside length and providing an outside surface area sufficient for firmly securing the base within the electron beam system. The base includes a contact area between each filament post and the base, the contact area having a length, the contact area length being significantly less than the outside length, thereby reducing the thermal contact area between the base and the filament post and reducing heat losses of the electron source.
A thermal field emitter of the present invention can be made smaller than prior art thermal field emitters, allowing it to be used in a wider array of

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