Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-12-05
2004-08-10
Cuneo, Kamand (Department: 2827)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S736000, C361S752000, C361S796000, C361S803000, C361S753000, C361S759000, C439S061000
Reexamination Certificate
active
06775151
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a structure for mounting, on a mother board, an electronic circuit unit which has a circuit board contained in a housing. More particularly, the invention relates to a structure for mounting an electronic circuit unit enabling a wiring pattern on the circuit board to be reliably connected to a wiring pattern on the mother board without involving defective soldering.
2. Description of the Related Art
In an electronic circuit unit
50
such as the one of a television tuner as shown in
FIG. 8
, a circuit board
51
mounting an electronic part such as IC parts that is not shown has been contained in a box-shaped housing
52
with its both ends being opened, and these two open ends of the hosing
52
have been closed with covers
53
.
FIG. 9
is a sectional view illustrating a state where the electronic circuit unit
50
is mounted on the mother board
54
along a line
9
—
9
in FIG.
8
.
Referring to
FIG. 8
, the circuit board
51
has a pair of extending portions
51
a
extending from one end side. Referring to
FIG. 9
, on each extending portion
51
a
is formed a terminal pattern
51
d
drawn from the wiring pattern
51
c
that is formed on one surface
51
b
of the circuit board
51
.
The housing
52
is provided with notches that are not shown, and the extending portions
51
a
of the circuit board
51
are allowed to protrude beyond the housing
52
through the notches. Further, pairs of mounting legs
52
a
are provided on both end surfaces of the housing
52
.
The thus constituted electronic circuit unit
50
is used being mounted on the mother board
54
on the set side as described below. If closely described, the mother board
54
has, formed therein, through holes
54
a
and
54
b
in which the extending portions
51
a
of the circuit board
51
and the mounting legs
52
a
of the housing
52
will be inserted. In the through holes
54
a
and
54
b
are inserted the corresponding extending portions
51
a
of the circuit board
51
and the mounting legs
52
a
of the housing
52
, and the electronic circuit unit
50
is mounted on the mother board
54
.
Here, the terminal pattern
51
d
formed on the extending portion
51
a
is soldered with a jet solder that is not shown onto the wiring pattern
54
d
formed on the back surface
54
c
of the mother board
54
.
According to the above conventional structure for mounting the electronic circuit unit
50
, however, the through holes
54
a
are formed in a size which includes a margin and are, hence, formed in a size slightly larger than the size of the extending portions
51
a
in order to prevent the terminal patterns
51
d
from peeling off that results when the terminal patterns
51
d
formed on the extending portions
51
a
come in contact with the inner walls of the through holes
54
a
at the time when the extending portions
51
a
are inserted in the through holes
54
a
of the mother board
54
.
In the conventional electronic circuit unit
50
, therefore, the extending portions
51
a
are inserted in the through holes
54
a
in a loose state and become rickety without accomplishing precise positioning. As shown in
FIG. 9
, further, a gap develops between the terminal pattern
51
d
on the extending portion
51
a
and the wiring pattern
54
d
on the back surface
54
c
of the mother board
54
giving rise to the occurrence of defective soldering.
To cope with a gap that develops between the terminal pattern
51
d
on the extending portion
51
a
and the wiring pattern
54
d
on the mother board
54
, it has also been attempted to incorporate in the production steps a step of pushing the circuit board
51
in a manner that the terminal pattern
51
d
comes into contact with the wiring pattern
54
d
resulting, however, in an increase in the number of the steps and causing the production steps to become complex.
SUMMARY OF THE INVENTION
This invention was proposed in view of the above conventional circumstances, and provides a structure for mounting an electronic circuit unit on a mother board highly precisely and easily without causing defective soldering.
Namely, this invention provides a structure for mounting an electronic circuit unit comprising:
a circuit board provided, on one end side thereof, with extending portions having first wiring patterns formed on the surfaces thereof;
a housing for containing the circuit board while permitting the extending portions to protrude outward; and
a mother board having, formed therein, through holes in which the extending portions are to be inserted, having, formed thereon, a second wiring pattern that is to be electrically connected to the first wiring patterns, and permitting the extending portions to be inserted in the through holes so that the housing is placed thereon;
wherein the circuit board is provided with pushing means which extends separately from the extending portions on one end side, and pushes the first wiring patterns onto the second wiring pattern.
By the above constitution, according to the structure for mounting the electronic circuit unit of the invention, the first wiring pattern formed on the extending portion of the circuit board is pushed onto the second wiring pattern formed on the mother board by the pushing means, whereby the development of a gap between the first wiring pattern and the second wiring pattern is prevented. Therefore, the first wiring pattern and the second wiring pattern can be connected together without causing defective soldering, and the circuit board can be mounted onto the mother board with high precision.
Here, it is desired that the pushing means is a protruded portion extending on one end side of the circuit board, that an insertion hole in which the protruded portion is to be inserted is formed in the mother board and that by forcibly inserting the protruded portion in the insertion hole, the first wiring patterns on the extending portions are pushed onto the second wiring pattern.
With the protruded portion being forcibly inserted in the insertion hole formed in the mother board, the first wiring patterns on the extending portions are strongly pushed onto the second wiring pattern of the mother board, making it possible to reliably prevent the occurrence of a gap between the first wiring patterns and the second wiring pattern.
Here, it is desired that the circuit board is provided with at least a pair of extending portions on one end side thereof, a pair of through holes are formed in the mother board so as to be corresponded to the pair of extending portions, and the protruded portion is located midway between the pair of extending portions.
With the protruded portion being forcibly inserted in the insertion hole, therefore, the first wiring patterns on both extending portions arranged on both sides of the protruded portion can be pushed onto the second wiring pattern with a uniform pushing force.
It is further desired that the insertion hole in which the protruded portion is to be inserted is formed at a position deviated in a direction in which the first wiring patterns are pushed onto the second wiring patterns from the positions of the through holes in which the extending portions are to be inserted.
Since the protruded portion is inserted in such a manner that the first wiring patterns are strongly pushed onto the second wiring pattern, it is allowed to more reliably and strongly bring the first wiring patterns into contact with the second wiring pattern.
Here, it is further desired that the protruded portion is tapered on the surface of the side opposite to the surface of the side on where the first wiring patterns of the circuit board are pushed onto the second wiring pattern. This enables the protruded portion to be more easily inserted in the insertion hole.
REFERENCES:
patent: 5159537 (1992-10-01), Okano
patent: 5907478 (1999-05-01), Watanabe
patent: 6388892 (2002-05-01), Maeda
patent: 6456505 (2002-09-01), Suzuki et al.
patent: 6551117 (2003-04-01), Poplawski et al.
patent: 2001-111260 (2001-04-01), None
Alps Electric Co. ,Ltd.
Brinks Hofer Gilson & Lione
Tran Thanh Y.
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