Electroplating apparatus and method

Details Electroplating apparatus and method Electroplating apparatus and method

1980-01-24

1981-09-22

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204234, 204275, C25D 110, C25D 2112, C25D 2118

Patent

active

042908566

ABSTRACT:
An electroforming or electrodeposition system in which the depleted metallic component in the electrolyte is replenished by an electrolyzing unit having an anode chamber communicating with the electroforming electrolyte receptacle and separated by an ion-exchange membrance from a cathode chamber. An anode in the anode chamber is dissolved electrolytically to furnish the metallic component. The electroforming current is measured to indicate the rate of depletion of the metallic component from the electroforming electrolyte, the measurement signal being used to control the electrolyzing current to dissolve the metallic component from the anode so that the ionic concentration of the metal in the receptacle is maintained substantially constant.

REFERENCES:
patent: 2072811 (1937-03-01), Ellsworth
patent: 3256165 (1966-06-01), Williams
patent: 4045304 (1977-08-01), Tezuka
UK Patent Application GB 2,010,330 A.

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