Method of curing thermoset bonding agent for non-distortion self

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

1562737, 1562755, 1562757, 156330, 1563317, 219 1053, B32B 3100, C09J 400

Patent

active

051299771

ABSTRACT:
A method of bonding areas of two elements of a sheet molded compound to form a bonded product includes intimate mixing of a thermoset epoxy or polyurethane adhesive with submicron particles selected from the group of gamma Fe.sub.2 O.sub.3 and magnetic iron oxide Fe.sub.3 O.sub.4, with the particles typically being 5 to 40% by weight of the final adhesive mixture to form a semi-liquid adhesive mixture. A bead of the adhesive mixture is located between the elements to be joined, and the elements are forced toward each other to compress and spread the semi-liquid adhesive mixture to form a flattened bonding element in intimate contact with the surfaces to be joined with an accurately controlled typical thickness of the adhesive of 0.005 inches to 0.2 inches. An induction coil is coupled to the elements and energized with a high frequency current of a frequency of from 1.5 to 8 MHz for a total period of about thirty seconds. The current level and time is controlled to first rapidly heat the adhesive without significant heating of the elements, and after the cure temperature is reached to reduce the power input and hold an optimum heat level for a sufficient time to create a gel condition. The bonded product is then transferred for further working.

REFERENCES:
patent: 2393541 (1946-01-01), Kohler
patent: 3222234 (1965-12-01), DeJean et al.
patent: 3367808 (1968-02-01), Edwards
patent: 4175283 (1979-11-01), Buchwald et al.
Readdy, Jr., A. F., "Plastics Fabrication by Ultraviolet, Infrared, Induction, Dielectric, and Microwave Radiation Methods", Plastics Evaluation Test Center, Picatinny Arsenal, Dover, N.J., Apr. 1972, pp. 80-83.

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