Method for attaching through-hole devices to a circuit board usi

Details Method for attaching through-hole devices to a circuit board usi Method for attaching through-hole devices to a circuit board usi

1991-10-25

1992-07-14

Rowan, Kurt

Metal fusion bonding

Process

Plural joints

228135, 228187, 228248, B23K 3102

Patent

active

051295733

ABSTRACT:
A process is disclosed from mounting through-hole components having closely-spaced electrical leads to a printed board (PCB) using solder paste. The process comprises applying conventional solder paste to alternating through-holes in an array of through-holes, inserting the through-hole component, applying solder paste to the remaining through holes on the opposite side of the circuit board and subsequently melting the solder (typically in a reflow oven) to form both a mechanical and an electrical connection of the through-hole component to the printed wiring board. Practice of this process alleviates the problem for solder bridges forming between adjacent leads or through-holes. Moreover, this process allows a PCB to be equipped with both surface mount and through-hole components without the need for a separate wave soldering operation to secure the through-hole devices.

REFERENCES:
patent: 3107414 (1963-10-01), Sterling
patent: 4044460 (1977-08-01), Schachter
patent: 4215025 (1980-07-01), Packer et al.

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