Multilayer electrodes for integrated circuit capacitors

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

29 2542, 357 51, H01G 101, H01L 300, H01L 2702

Patent

active

050051024

ABSTRACT:
Disclosed is a multilayer capacitor structure in an integrated circuit, including a first electrode constructed by forming at least one layer over a substrate and forming a plate layer over the previous layer(s). A dielectric layer is formed over this first electrode, and a second electrode is established over the dielectric layer by forming a plate layer over the dielectric layer, and forming at least one additional layer over the plate layer. Each layer may serve one or more functions. Also disclosed is a further embodiment including constructing a first electrode by forming at least one layer on a substrate, forming a plate layer over the previous layer(s), and forming a dielectric layer over the first electrode. The resulting structure is then heated, preferably in an oxygen ambient, to oxidize the lower layer. A second electrode can then be formed over the dielectric layer.

REFERENCES:
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patent: 3699409 (1972-10-01), Feversanger et al.
patent: 4849801 (1989-07-01), Honjyo et al.
R. D. Huttermann et al., "Silicon Tantalum Integrated Circuit Processing," 31st Electronic Components Conference, May 11-13, 1981, Colony Square Hotel, Atlanta, Georgia, paragraphs 1-2, FIG. 2.
J. K. Howard, "Capacitor Structure for Bipolar Memory Device," IBM Technical Disclosure Bulletin, 5/81, pp. 5373-5374.
"TEM studies during development of a 4-megabit DRAM," Microscopy of Semiconducting Materials, 1987, Proceedings of the Institute of Physics Conference, Oxford, UK, 6-8, April 1987, abstract, paragraph 5.
I. Stoev and F. Schumacher, "Preparation and RF Properties of MIS Mesa Varacters", Journal of the Asia Electronics Union, 8/7/73, abstract, paragraphs 1-2.

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