Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2002-03-19
2004-10-19
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S204000, C156S226000, C361S749000
Reexamination Certificate
active
06805767
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a production method for a solid-state image pickup (sometimes herein referred to as a solid image pickup device) device comprising a solid-state image pickup element (sometimes herein referred to as a solid image pickup element) and an optical lens. More specifically, this invention relates to a production method for a solid-state image pickup device suitable for miniaturization, having a small volume and high external shape and size accuracy.
BACKGROUND OF THE INVENTION
FIG. 13
shows an example of a conventional production method for a solid-state image pickup device. The solid-state image pickup device comprises a solid-state image pickup element and an optical lens, with a flexible wiring board folded and fixed. In
FIG. 13
, the numeral
1
denotes a flexible wiring board (hereinafter referred to as an FPC),
1
a
denotes an FPC lead section,
2
b
denotes a reinforcing plate,
3
denotes an external connection element,
4
denotes a fixed base,
5
denotes a fixed cap,
13
denotes a housing, and
101
denotes a pressing clip.
The conventional production method will be explained while referring to FIG.
13
. First, the FPC
1
is folded for the miniaturization of device. An adhesive is supplied to the inner part of the folded FPC
1
generated at the time. Then, the pressing clip
101
is applied such that the fixed cap
5
and the FPC
1
are forced lightly by the spring force of the pressing clip
101
. Next, by hardening the adhesive in this state, a miniaturized solid image pickup device can be obtained.
Since the conventional solid image pickup device has the above-mentioned configuration, it is difficult to stabilize the spring force of the pressing clip
101
at the time of folding the FPC
1
and fixing the same with the adhesive so there is a large external size irregularity.
Moreover, since irregularity is generated in terms of the spring force of the pressing clip
101
and the position of the load applied on the contacting part at the time of clipping, a problem of difficulty in constantly providing the solid image pickup device shape, is involved.
The shape instability and the external size irregularity require an excessive size tolerance in a storage space in storing the solid image pickup device in a case or the like, so there is a serious problem in designing when, in particular, mounting the pickup device in a small appliance such as a portable phone. Furthermore, the part of the fixed cap
5
to be contacted with the pressing clip
101
can easily be flawed, and thus a problem is also involved in terms of the external appearance.
SUMMARY OF THE INVENTION
It is an object of this invention to provide a solid image pickup device with a miniaturized shape and size, and a reduced size error while maintaining the image pickup performance and the shape performance of the solid image pickup device so as to enable easily assembly in a small appliance, such as a portable phone.
The production method according to one aspect of this invention provides a method of producing a solid image pickup device comprising a solid image pickup element, and an optical lens held in a housing provided in a flexible wiring board. This method comprises, using a fixing device, bonding and fixing the flexible wiring board in a folded state corresponding to an external shape of the solid image pickup device. According to this method, the part in contact with the fixed cap and the part in contact with the flexible wiring board (or the reinforcing plate) can always be pressured at the same position.
The production method according to another aspect of this invention provides a method of producing a solid image pickup device comprising a solid image pickup element, an optical lens held in a housing, and an IC part provided in a flexible wiring board. This method comprises, using a fixing device, bonding and fixing the flexible wiring board in a folded state corresponding to an external shape of the solid image pickup device.
Other objects and features of this invention will become apparent from the following description with reference to the accompanying drawings.
REFERENCES:
patent: 5748448 (1998-05-01), Hokari
patent: 5821532 (1998-10-01), Beaman et al.
patent: 6147389 (2000-11-01), Stern et al.
patent: 6541284 (2003-04-01), Lam
patent: 6646316 (2003-11-01), Wu et al.
patent: 2001/0055073 (2001-12-01), Shinomiya
patent: 2002/0044213 (2002-04-01), Shinomiya et al.
patent: 2002/0080266 (2002-06-01), Shinomiya et al.
U.S. patent application Ser. No. 09/791,584, Kohji Shinomiya, filed Feb. 26, 2001.
U.S. patent application Ser. No. 09/799,690, Shinomiya et al., filed Mar. 7, 2001.
U.S. patent application Ser. No. 09/814,825, Shinomiya et al., filed Mar. 23, 2001.
Aftergut Jeff H.
Leydig , Voit & Mayer, Ltd.
Renesas Technology Corp.
Rossi Jessica
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