Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2001-04-10
2004-10-26
Zarneke, David (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S502000, C257S503000, C257S693000, C257S694000, C257S782000, C257S784000
Reexamination Certificate
active
06809410
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a connection structure between an external connecting electrode and an electrode terminal of a power semiconductor module on an exterior case for power semiconductor module.
FIG. 9
is a cross-sectional explanatory view showing one example of a conventionally known connection structure between an electrode terminal and an electrode plate which is an exterior connecting electrode on an exterior case for power semiconductor module. The exterior case
82
for power semiconductor module includes an electrode terminal
83
and a terminal nut
85
. One end of the electrode terminal
83
is electrically connected to an electrode plate
97
on the side of an outer surface of the case. The terminal nut
85
is used for fastening the electrode terminal
83
and the electrode plate
97
on an upper surface of the case. The electrode terminal
83
and the terminal nut
85
are integrally insert-formed together with a case body in a step for molding an exterior case
82
. After the insert-forming, the electrode terminal
83
is bent such as to cover the terminal nut
85
. The electrode terminal
83
is formed with a bolt-insertion hole
84
along its thickness direction. In a state in which the electrode terminal
83
is bent, a center axis of the bolt-insertion hole
84
coincides with a center axis of a female screw hole of the terminal nut
85
fixed on the side of an outer surface of the case.
To connect the electrode plate
97
with electrode terminal
83
, the electrode plate
97
is positioned on the electrode terminal
83
such that a center axis of a bolt-insertion hole
98
formed along a thickness direction of the electrode plate
97
coincides with a center axis of the female screw hole of the terminal nut
85
and the bolt-insertion hole
84
of the electrode terminal
83
, and in this state, a fastening bolt
89
is fastened to the terminal nut
85
through the electrode plate
97
and the electrode terminal
83
. With this operation, the electrode plate
97
and the electrode terminal
83
are electrically connected to each other, and an electric signal generated in the power semiconductor module is introduced into the electrode plate
97
through the electrode terminal
83
.
However, in the case of the conventional power semiconductor module having the connecting structure with the external connection electrode (i.e. electrode plate
97
), it is necessary to fasten the fastening bolt
89
in a state in which the electrode plate
97
is held at a predetermined position. This makes it troublesome to position the electrode plate
97
with respect to the electrode terminal
83
when the number of electrode terminals included in the power semiconductor module is large. Especially when a large number of power semiconductor modules are used, or when the power semiconductor module is located at a position where it is difficult to position the electrode plate
97
to the electrode terminal
83
, there is a problem that the working time to assemble power semiconductor module becomes longer.
It is an object of the invention to provide a connection structure between an external connecting electrode and an electrode terminal of a power semiconductor module on an exterior case for power semiconductor module, which is capable of using an existing power semiconductor module as it is, capable of easily positioning an external connection electrode with respect to an electrode terminal, and capable of realizing efficient assembling operation.
SUMMARY OF THE INVENTION
According to an aspect of the present invention, there is provided a power semiconductor module with a connection structure in which an electrode terminal whose one end is connected with an electric power semiconductor device which is resin sealed inside of the case, is exposed along an outer surface of a case for taking out electrode from the semiconductor device, and is electrically connected to an electrode for external connection disposed on the electrode terminal, wherein a female screw hole for screwing is provided on side of the outer surface of the case, a male screw member formed at its opposite ends with screw threads is threadedly engaged with the female screw hole through the electrode terminal.
A nut having the female screw hole may be embedded in the outer surface of the case, and the nut may be fixed to a lower surface of the electrode terminal.
The electrode terminal may have the female screw hole.
The male screw member may have different nominal diameters at opposite ends.
The male screw member may have threads at opposite ends of which directions are opposite from each other.
At least one nut may be fixed to a middle portion of the male screw member.
A middle portion of the male screw member may be formed with a discontinuous portion having no screw thread.
The male screw member may be threadedly engaged with the female screw hole through a plurality of electrode terminals.
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Mitsubishi Denki & Kabushiki Kaisha
Tran Thanh Y.
Zarneke David
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