Surface emitting semiconductor laser

Coherent light generators – Particular active media – Semiconductor

Reexamination Certificate

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C372S045013

Reexamination Certificate

active

06687276

ABSTRACT:

CROSS REFERENCE TO RELATED APPLICATIONS
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-353113, filed on Nov. 20, 2000; the entire contents of which are incorporated herein by reference.
BACKGROUND
1. Field of the Invention
The present invention relates to a surface emitting semiconductor laser, and is suitably applicable particularly to an InGaAlP quantum well structure surface emitting semiconductor laser.
2. Description of the Related Art
Recently, a semiconductor laser emitting in the range of wavelengths from 600 to 700 nm has been put into practical use in a field such as DVD (digital versatile disk) or the like.
Meanwhile, a surface emitting semiconductor laser, if being put into practical use in this wavelength region, will be used as a light source for a high speed plastic fiber link. As a surface emitting semiconductor laser realizing such wavelength region, there is an InGaAlP surface emitting semiconductor laser. In order to lower a threshold current of the InGaAlP surface emitting semiconductor laser, there is a surface emitting semiconductor laser in which active layer a quantum well structure is adopted.
FIG. 10A
is a perspective view showing a configuration of an existing InGaAlP quantum well surface emitting semiconductor laser. In
FIG. 10A
, on an n-GaAs substrate
1
, there are stacked in turn a DBR (Distributed Bragg Reflector) multi-layer film
2
, an n-InGaAlP clad layer
3
, an MQW (Multiple Quantum Well) active layer
4
, a p-InGaAlP clad layer
5
, a DBR multi-layer film
6
, and a p-GaAs cap layer
7
. On a back surface of the n-GaAs substrate
1
, there is formed an n-side electrode
8
, on the p-GaAs cap layer
7
there being formed a p-side electrode
9
. In the p-GaAs cap layer
7
and the p-side electrode
9
, there is formed a disk like opening to form a light exit window
10
for taking out emitted light.
The active layer
4
is formed of In
0.5
Ga
0.5
P/In
0.5
(Ga
0.5
Al
0.5
)
0.5
P film; the clad layer
3
being formed of an n-In
0.5
(Ga
0.3
Al
0.7
)
0.5
P film; the clad layer
5
being formed of a p-In
0.5
(Ga
0.3
Al
0.7
)
0.5
P film; the DBR multi-layer film
2
being formed of an n-Ga
0.5
Al
0.5
As/Ga
0.05
Al
0.95
As film; the DBR multi-layer film
6
being formed of a p-Ga
0.5
Al
0.5
As/Ga
0.05
Al
0.95
As film.
Furthermore, the active layer
4
and the clad layers
3
and
5
form a resonator of the surface emitting semiconductor laser, and at the active layer
4
in the center a film thickness is designed to be an antinode of a standing wave of one wavelength.
FIG. 10B
is an enlargement of a portion of the active layer and the clad layers in FIG.
10
A. In
FIG. 10B
, the MQW active layer
4
, which is formed by repeating to alternately stack an In
0.5
(Ga
0.5
Al
0.5
)
0.5
P film
4
a
and an In
0.5
Ga
0.5
P film
4
b
, is sandwiched by the clad layers
3
and
5
to form a double heterostructure junction.
FIG. 10C
is an energy band diagram of a portion of the active layer
4
and the clad layers
3
and
5
. In
FIG. 10C
, the In
0.5
Ga
0.5
P films
4
b
being smaller in their band gaps in comparison with the In
0.5
(Ga
0.5
Al
0.5
)
0.5
P films
4
a
, there are formed quantum wells QW at the portion of the In
0.5
Ga
0.5
P films
4
b
. In the quantum wells QW, energy levels are quantized, and thereby energy levels of electrons injected into the active layer
4
may be localized. As a result, the laser may be efficiently oscillated, the threshold current being lowered.
In addition, the clad layers
3
and
5
, which are formed of the n-In
0.5
(Ga
0.3
Al
0.7
)
0.5
P film, are larger in their band gaps than those of the In
0.5
Ga
0.5
P/In
0.5
(Ga
0.5
Al
0.5
)
0.5
P films. As a result, electrons and holes injected through the clad layers
3
and
5
may be confined inside the active layer
4
, the laser being efficiently oscillated.
In the existing MQW structure surface emitting semiconductor laser, in order to enhance a gain, it is general to set a well width Hb at 7 nm or more and the number of wells Wn at five or more. However, in the active layer
4
adopting the MQW structure, when the well width is 7 nm or more and the number of the wells is five or more, heat generation from the active layer
4
becomes larger, resulting in deterioration of high temperature properties.
The object of the present invention is to provide a surface emitting semiconductor laser capable of improving the high temperature properties.
SUMMARY
A surface emitting semiconductor laser according to an embodiment of the present invention includes an active layer having an InGaAlP quantum well structure of which well width is from 4 nm to 6 nm and of which number of wells is one or two, InGaAlP clad layers formed above and below the active layer, and light reflecting layers formed, in a stacking direction of the active layer, further above and below the clad layers through the respective clad layers.


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Jalonen, et al. “Oxide-Confined Resonant Cavity Red Light-Emitting Diode Grown by Solid Source Molecular Beam Epitaxy” Electronics Letters Nov. 6, 1997 vol. 33 No. 23.
Smowton, et al. “Invited Paper Role of Sublinear Gain-Current Relationship in Compressive and Tensile Strained 630nm GaInP Lasers” International Journal of Optoelectronics, 1995, vol. 10, No. 5, pp. 383-391.
Gauggel, et al. “Fabrication and Operation of First-Order GaInP/AIGaInP DFB Lasers at Room Temperature” Electronics Letters Mar. 2, 1995 vol. 31 No. 5 pp. 367-368.
Schneider, et al. “MOVPE Growth of InAIGaP-Based Visible Vertical-Cavity Surface-Emitting Lasers” Journal of Crystal Growth 124 (1993) 763-771.
U.S. patent application No. 09/639,018 filed Aug. 15, 2001 by Koichi GEN-El et al.

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