Electrical connector with retention protrusions

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C439S330000, C439S331000

Reexamination Certificate

active

06699047

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electrical connector for electrically connecting an electronic package such as a land grid array (LGA) chip with a circuit substrate such as a printed circuit board (PCB), and particularly to an electrical connector with improved retention protrusions for conveniently and securely positioning an LGA chip in the electrical connector.
2. Description of the Prior Art
Land grid array (LGA) electrical connectors are widely used in the connector industry for electrically connecting LGA chips to printed circuit boards (PCBs) in personal computers (PCs). Details are provided in “Nonlinear Analysis Helps Design LGA Connectors” (Connector Specifier, February 2001, pp. 18-20). Conventionally, one kind of the LGA connector mainly comprises an insulative housing, a multiplicity of terminals received therein, and a load plate and a cam lever pivotably mounting on two opposite sides of the housing. The housing defines a multiplicity of terminal passageways in a rectangular array, for interferentially receiving corresponding terminals. Due to the very high density of the terminal array which an LGA chip may have, the LGA chip needs to be precisely seated on the LGA connector. This is to ensure reliable signal transmission between the terminals and the LGA chip. For example, means for accurately attaching an LGA chip to an LGA connector are disclosed in U.S. Pat. Nos. 4,504,105 and 4,692,790.
Referring to
FIG. 5
, a conventional LGA connector
6
comprises an insulative housing
60
, a multiplicity of terminals
61
received in the housing
60
, and a load plate
62
and a cam lever
63
pivotably mounted on two opposite sides of the housing
60
. The load plate
62
defines a channel
620
receiving the cam lever
63
. To mount an LGA chip (not shown) on the LGA connector
6
, the load plate
62
is rotated up until it is perpendicular to the housing
60
. The LGA chip is seated in the housing
60
, and is loosely engaged with the terminals
61
. The load plate
62
is rotated down so that it rests on the LGA chip. The cam lever
63
is rotated down until it engages in the channel
620
of the load plate
62
. When the cam lever
63
has reached the end of its travel, the load plate
62
presses the LGA chip into firm engagement with the terminals
61
of the connector
6
.
In the above-described assembly process, the load plate
62
presses the LGA chip between two opposite sides of the housing
60
of the connector
6
. Generally, a material of the housing
60
is not resilient, and the sides of the housing
60
can not elastically deform under pressure from the LGA chip. If the LGA chip is narrower than a distance between the opposite sides of the housing
60
, the LGA chip may be poorly positioned relative to the terminals
61
. This can adversely affect mechanical and electrical connection between the LGA chip and the connector
6
. If the LGA chip is wider than a distance between the opposite sides of the housing
60
, the housing
60
is liable to break. Furthermore, when the load plate
62
presses the LGA chip to firmly engage with the terminals
61
, the housing
60
is liable to break if asymmetrical force is inadvertently applied thereto.
FIG. 6
shows another conventional LGA connector
6
′ devised to overcome the above-described problem. The connector
6
′ comprises an insulative housing
60
′, and a multiplicity of terminals
61
′ received therein. In forming the connector
6
′, a carrier strip (not shown) is used. The carrier strip comprises a row of the terminals
61
′, and a row of connecting sections (not shown) respectively connecting the terminals
61
′ with a main body of the carrier strip. The housing
60
′ comprises four raised sidewalls
62
′, and a flat base
63
′ disposed between the sidewalls
62
′. The base
63
′ and the sidewalls
62
′ cooperatively define a space therebetween for receiving an LGA chip (not shown) therein. The base
63
′ defines a multiplicity of terminal passageways
64
′ for receiving the terminals
61
′ therein. When the LGA chip is seated on the LGA connector
6
′, the four sidewalls
62
′ can securely engage the LGA chip therebetween.
However, installation of terminals
61
′ into those passageways
64
near two of the sidewalls
62
′ is problematic. Once the terminals
61
′ have been inserted into such passageways
64
′, the connecting sections of the carrier strip must be cut from their corresponding terminals
61
′. Because the carrier strip is located close to the relevant sidewall
62
′, there is insufficient space to manipulate the carrier strip to allow easy cutting off of the connecting sections. Such manipulation is blocked by the sidewall
62
, which is liable to sustain damage as a result.
Therefore, a new LGA electrical connector which overcomes the above-mentioned problems is desired.
SUMMARY OF THE INVENTION
An object of the present invention is to provide an electrical connector for electrically connecting an electronic package such as a land grid array (LGA) chip with a circuit substrate such as a printed circuit board (PCB), whereby the electrical connector can quickly and conveniently guide the LGA chip into its correct position.
Another object of the present invention is to provide an electrical connector having means for accurately positioning an electronic package such as an LGA chip thereon, whereby manufacturing and transportation costs of the electrical connector are reduced.
To achieve the above objects, an electrical connector in accordance with a preferred embodiment of the present invention is for connecting an LGA chip with a PCB. The connector includes an insulative housing, a frame engaged with the housing, and a plurality of terminals received in the housing. The housing defines four sides. A plurality of arcuate protrusions is formed on two adjacent of the sides. The frame has four sidewalls defining a central cavity therebetween for receiving the LGA chip therein. Two adjacent of the sidewalls define a plurality of cutouts in respective inner faces thereof, corresponding to the protrusions respectively. The frame is mounted on the housing, with the protrusions being engagingly received in the corresponding cutouts. When the LGA chip is engaged with the connector, the protrusions elastically deform to accurately guide and securely fix the LGA chip in the connector.


REFERENCES:
patent: 4164003 (1979-08-01), Cutchaw
patent: 5833472 (1998-11-01), Bright

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