Encapsulated circuitized power core alignment and lamination

Details Encapsulated circuitized power core alignment and lamination Encapsulated circuitized power core alignment and lamination

1990-10-30

1992-07-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 174 36, 174262, 174263, H01K 310

Patent

active

051291428

ABSTRACT:
A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

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