Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate
2001-09-07
2004-10-12
Porta, David (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
Photocell controlled circuit
C250S2140AG, C330S308000
Reexamination Certificate
active
06803555
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to electro-optical detectors and in particular to amplifiers for interfacing with electro-optical detectors, such as photovoltaic detectors.
BACKGROUND
Many modem systems rely on electro-optical detectors, or sensors, to sense a portion of the electromagnetic spectrum. These systems might include telecommunications systems, fiber-optic systems, imaging systems, cameras, and other commercial and military systems. The electro-optical sensors of these systems can be critical components in determining performance, sensitivity, cost, and dynamic range of the overall system.
To achieve a very high level of performance, many modem electro-optical sensors include two primary functional components. The first component is a detector element or detector array. One detector element commonly used is a photovoltaic detector element. The second functional component is the readout multiplexer.
For electro-optical sensors operating in the visible spectrum and up to approximately 1.0 &mgr;m wavelength radiation, silicon is commonly used to fabricate both the detector (e.g., a single detector element or an array of detector elements) and the readout multiplexer. For optical sensors operating at significantly shorter or longer wavelengths, alternative semiconductor materials may be selected for the detector to provide more efficient sensitivity for the desired region of the electromagnetic spectrum. In this case, it may be desirable to use different materials to fabricate the detector and the readout multiplexer, since the readout multiplexer can still be fabricated in silicon.
Electrical signals from individual detector elements are processed by electronics signal chains, which have become increasingly sophisticated in modern electro-optical sensors. The signal chains are now designed to optimize the impedance interface to the detector elements; the integration of the electrical signals; the noise performance of the sensor; and the signal storage, multiplexing, and processing to an optimized systems interface.
FIG. 1A
 is a circuit diagram and 
FIG. 1B
 is a cross-sectional side view of a typical pn junction photovoltaic detector element 
10
. As shown in 
FIG. 1A
, detector element 
101
 is a diode structure including an anode 
11
 and a cathode 
12
. A terminal 
13
 is electrically coupled to anode 
11
, and a terminal 
14
 is electrically coupled to cathode 
12
. Detector element 
10
 may be fabricated by diffusing a p-type region 
15
 into an n-type semiconductor 
16
, thereby forming a pn junction as shown in FIG. 
1
B. Since detector element 
10
 is a diode structure that is responsive to illumination, detector element 
10
 is also called a photodiode.
In electro-optical systems, an electromagnetic image is spatially sampled in units called pixels. Detector element 
10
 can be used to sample a single pixel at a time. Thus, detector element 
10
 is also sometimes referred to as a pixel. Depending on the application and the format of detector array, the image may or may not be scanned. If the image is scanned, it may be scanned in one dimension or in two dimensions. For example, to sample a line of an electro-magnetic image, a line array of detector elements 
10
 is provided, or the image is scanned across the single detector element 
10
.
FIG. 2A
 is a circuit diagram and 
FIG. 2B
 is a perspective view of a typical pn junction photovoltaic detector array 
20
. In 
FIG. 2A
, detector array 
20
 includes four detector elements 
10
, each with terminals 
13
 and 
14
. Typical line arrays of this type in current systems may include as many as 
512
, or more, detector elements 
10
. Individual detector elements 
10
 are fabricated in close proximity to each other in the necessary quantity to support the system application. In 
FIG. 2B
, four p-type regions 
15
 (one for each detector element 
10
) are shown arranged in a line and diffused into n-type semiconductor 
16
. Sampling of a two-dimensional image can be accomplished by fabrication of a plurality of detector elements 
10
 arranged in a two-dimensional array, also called a staring array. Typical two-dimensional arrays in current systems may include 1024×1024, or more, detector elements 
10
.
FIG. 3
 is a graphical illustration of a current-voltage (IV) characteristic of pn junction photovoltaic detector element 
10
 of 
FIG. 1A
 under illumination. The right and left halves of the diagram are referred to as the forward bias (FB) and reverse bias (RB) regions, respectively. Under forward bias, the zero current intercept, also called the forward voltage (V
F
), of detector element 
10
 is a function of the illumination level. Similarly, under reverse bias, the reverse bias current is also a function of the illumination level. The reverse bias current, however, may also include a junction leakage current component and, under high reverse bias, a reverse bias breakdown current component.
Depending on material quality and properties, the magnitudes of the leakage current and/or the reverse bias breakdown current may be as large as, or larger than, the detector element photocurrent, which is the signal of interest. The extraneous leakage and reverse bias breakdown currents may degrade performance and dynamic range of the electro-optical sensor.
For a detector with a single detector element 
10
, it is reasonable to interface between the readout multiplexer and detector element 
10
 using wires or printed circuit board traces. In one-dimensional line arrays or two-dimensional staring arrays, however, the detector element count may be as large as 
512
 detector elements 
10
, or even over one million detector elements 
10
, respectively. In these cases, wire and circuit board trace interfaces are unrealistic, and it is desirable to have the readout multiplexer of the electro-optical sensor in close physical proximity to detector elements 
10
 to facilitate electrical coupling of detector elements 
10
 to the readout multiplexer.
Direct electrical coupling of detector elements 
10
 to the readout multiplexer allows the sizes of detector elements 
10
 to be small, reducing the overall size of the detector array. Integrated circuit wire bonding and bump bonding techniques have been employed to achieve such electrical interfaces. 
FIG. 4
 is a perspective illustration of an electro-optical sensor 
40
 including an electro-optical detector 
41
 in close proximity to an integrated circuit readout multiplexer 
42
. Detector 
41
 includes a plurality (i.e., an array) of detector elements 
10
, each of which is coupled to an electronics signal chain for processing the signal from each detector element 
10
.
FIG. 5
 is a circuit diagram of an array 
50
 of four detector elements 
10
 (i.e., photodiodes) each coupled to an integrating amplifier 
51
. Each integrating amplifier 
51
 includes, due to materials and manufacturing variations, a unique input offset voltage (labeled Vos
1
, Vos
2
, Vos
3
, and Vos
4
, respectively) shown explicitly coupled between terminal 
13
 of each detector element 
10
 and the input of each integrating amplifier 
51
.
FIG. 6A
 is a graphical illustration of a current-voltage (IV) characteristic for array 
50
 of 
FIG. 5
, for a large input offset voltage distribution. The relatively large variation in the values of the input offset voltages Vos
1
, Vos
2
, Vos
3
, and Vos
4 
of each integrating amplifier 
51
 is shown for illustration purposes. The effect of variations in the input offset voltages of integrating amplifiers 
51
 is to cause each detector element 
10
 to operate at a different bias point on its IV curve. The current from each detector element 
10
 will thus show an offset variation that is dependent on the IV characteristic of the detector element 
10
 and the magnitude of the input offset voltage distribution from integrating amplifiers 
51
. These offset currents introduce variations in the output signals for each detector element 
10
. In some cases, these variations can represent a significant portion of the dynamic range of the signal levels of detector
Aziz Naseem Y.
Parrish William J.
Indigo Systems Corporation
MacPherson Kwok Chen & Held LLP
Michelson Greg J.
Porta David
Yam Stephen
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