Semiconductor pellet assembly mounted on ceramic substrate

Details Semiconductor pellet assembly mounted on ceramic substrate Semiconductor pellet assembly mounted on ceramic substrate

1975-09-08

1977-02-22

James, Andrew J.

357 70, 357 79, 357 80, 357 81, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

040094855

ABSTRACT:
Disclosed is an isolated semiconductor assembly with a pellet mounting plate having a beveled periphery and surmounted by a semiconductor pellet. A ribbon-shaped lead overhangs the edge of the top of the pellet and terminates in the plane of the lower side of the mounting plate. A ceramic substrate has conductive leads bonded thereto, portions of which are in registry with and bonded to the plate and ribbon-shaped lead. External connections can be made to other areas of the conductive leads.

REFERENCES:
patent: 3292056 (1966-12-01), Emeis et al.
patent: 3483444 (1969-12-01), Parrish
patent: 3708720 (1973-01-01), Whitney
patent: 3885243 (1975-05-01), Weisshaar et al.
patent: 3916433 (1975-10-01), Schierz
patent: 3922775 (1975-12-01), Potter
patent: 3935501 (1976-01-01), Sterbal
patent: 3938177 (1976-02-01), Hansen et al.

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