Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1995-12-04
1998-01-13
Wilson, Donald R.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523428, 523429, C08K 720, C08L 6302, C08L 6304
Patent
active
057080569
ABSTRACT:
A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enhance the fatigue life of the solder joints. The encapsulation material is a reactive hot melt epoxy that is curable at temperatures significantly lower than that required for previous epoxy-based encapsulation materials. As such, processing of the circuit assembly is greatly facilitated, while the benefit of encapsulated solder joints is achieved for the assembly. The encapsulation material further includes a latent curative and a filler material for lower the coefficient of thermal expansion of the encapsulation material.
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Lee et al., "Handbook of Epoxy Resins", McGraw Hill Book Co. NY, pp. 7/15 & 10/17 (Reissue 1982).
Emerick et al., "Enhancement of TSOP Solder Joint Reliability Using Encapsulation," IEEE Proceedings.
Hermansen Ralph D.
Lindley Theresa Renee
Rosson James M.
Sanftleben Henry Morris
Wennberg Samuel R.
Delco Electronics Corporation
Funke Jimmy L.
Hughes Electronics
Wilson Donald R.
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