Dispersion strengthened copper-base alloy for overlay

Details Dispersion strengthened copper-base alloy for overlay Dispersion strengthened copper-base alloy for overlay

1990-07-30

1991-04-02

Dean, R.

Alloys or metallic compositions

Copper base

Nickel containing

148412, 148413, 148414, 148433, 148434, 148435, 420473, 420481, C22C 902, C22C 904/9/06, C22C 908

Patent

active

050045814

ABSTRACT:
A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %,

REFERENCES:
patent: 3293029 (1966-12-01), Broderick et al.
patent: 3372010 (1968-03-01), Parsons et al.
patent: 4244679 (1981-01-01), Nakayama et al.
patent: 4818307 (1989-04-01), Mori et al.
patent: 4851191 (1989-07-01), Lee et al.
Cu-Sn phase diagram (Fig. 3-290) and Cu-Zn phase diagram (Fig. 3-297), "Metal Data Book", Maruzen (1974), pp. 442-443.
Diagram of Oxide Formation Free Energy-Temperature, F. D. Richardson et al., J. Iron Steel Inst., 160, 261(1948).
Monma and Sudo: "Constructional Metal Materials and Heat-Treatment Therefor", Japan Institute of Metals, 1980, pp. 20-25, 40-41.

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