Method of making a circuitized substrate using two different met

Details Method of making a circuitized substrate using two different met Method of making a circuitized substrate using two different met

1995-12-01

1998-01-13

Niebling, John

Fishing, trapping, and vermin destroying

438678, 438669, H01L 21445

Patent

active

057078939

ABSTRACT:
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.

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