Fishing – trapping – and vermin destroying
Patent
1995-02-06
1996-04-16
Thomas, Tom
Fishing, trapping, and vermin destroying
437209, 437214, 437217, 437220, H01L 2160
Patent
active
055082327
ABSTRACT:
In a method of manufacturing a semiconductor device, overlaid on a first lead frame including a die pad supported by a plurality of die pad suspending leads is a second lead frame having connecting leads wherein the first and second lead frames are disposed on a first molding die such that the die pad and inner lead portions of the inner leads of the second lead frame are accommodated within a first cavity of the first molding die while offset portions of the die pad suspending leads are disposed outside of the first cavity. A second molding die is clamped onto the first molding die to define a resin molding chamber which is then filled with a molten resin to form a package. After removing the package from the first and second molding dies, the offset portions are cut away from the package while cutting the connecting leads to a predetermined length. A semiconductor chip as large as permissible can be embedded within a semiconductor device of a standard size while ensuring high quality and improved reliability of the semiconductor device.
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Koyama Yutaka
Michii Kazunari
Ueda Naoto
Ueda Tetsuya
Mitsubishi Denki & Kabushiki Kaisha
Picardat Kevin M.
Thomas Tom
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