Ultrasonic wire bonder

Details Ultrasonic wire bonder Ultrasonic wire bonder

1989-08-25

1990-09-25

Ramsey, Kenneth J.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, B23K 2010

Patent

active

049587625

ABSTRACT:
An ultrasonic wire bonder includes first and second ultrasonic wave applying devices, the direction of vibration of the first ultrasonic wave being orthogonal to that of the second ultrasonic wave. One of the first and second ultrasonic waves or a composite ultrasonic wave thereof is applied to a capillary and/or a support base for wire bonding, depending upon the bonding direction along which a wire is extended, or the inner lead longitudinal direction. A unit for detecting the positions of a semiconductor chip and lead frame may be provided to adjust a position and control the ultrasonic wave to be applied.

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