Method for producing thin film multilayer wiring board

Details Method for producing thin film multilayer wiring board Method for producing thin film multilayer wiring board

1995-06-26

1998-01-13

Zirker, Daniel

Stock material or miscellaneous articles

Composite

Of polyimide

29852, 174259, 174266, 428354, 428355, B32B 712, B32B 2700

Patent

active

057077495

ABSTRACT:
A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 4933045 (1990-06-01), DiStefano et al.
patent: 5055343 (1991-10-01), Murphy
Jap-A-2-45998; Feb. 15, 1990 Hitachi K.K.
J.P.-A-2-94594 Apr.05, 1990 Hitachi Ltd.

Affiliated with

Also associated with

Rating

Method for producing thin film multilayer wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing thin film multilayer wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing thin film multilayer wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-324788