Tin strip formulation for metal to glass seal diodes

Details Tin strip formulation for metal to glass seal diodes Tin strip formulation for metal to glass seal diodes

1975-10-22

1977-02-22

Herbert, Jr., Thomas J.

Coating processes

Electrical product produced

Condenser or capacitor

156655, 156 98, 252791, 427142, B05D 512, B23P 700

Patent

active

040092992

ABSTRACT:
Immersion of semiconductor devices, particularly diodes, having a defective tin plating thereon in a solution of 5 - 20 percent by weight trichloroacetic acid, 0.1 to 5 percent by weight of a compound selected from the group consisting of cationic, anionic, and nonionic surfactants and the balance water effectively removes the tin therefrom. The process is effective at room temperature but preferably is performed at approximately 100.degree. C.

REFERENCES:
patent: 2721119 (1955-10-01), Bauch
patent: 3072579 (1963-01-01), Newman

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