Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2002-10-22
2004-04-27
Nasri, Javaid H. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C174S266000, C333S254000, C361S794000
Reexamination Certificate
active
06726488
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a high-frequency wiring board for connecting and mounting a high-frequency integrated circuit or a high-frequency circuit device such as an IC and an LSI used in a high-frequency band such as a microwave band and a millimeter waveband, and specifically, relates to a high-frequency wiring board which has a through conductor for signal transmission with an improved high-frequency signal transmission characteristic.
2. Description of the Related Art
As a conventional high-frequency wiring board which transmits a high-frequency signal of a microwave band and a millimeter waveband, there is such a high-frequency wiring board that is shown in a section view of
FIG. 8 and a
plan view of
FIG. 9
, for example.
In
FIGS. 8
,
9
, reference numeral
11
denotes a high-frequency wiring board, reference numeral
12
denotes a dielectric layer, a first line conductor
13
and a second line conductor
14
are disposed to upper and lower faces of the dielectric layer
12
, and one ends of the first and second line conductors
13
,
14
are electrically connected to each other by a through conductor
15
. Moreover, same plane ground conductors
16
are disposed to the upper and lower faces of the dielectric layer
12
, and the same plane ground conductors
16
are electrically connected to each other by a plurality of ground through conductors
17
.
This high-frequency wiring board
11
has such a drawback that because of stray capacities at connections of the first and second line conductors
13
,
14
and the through conductor
15
, a mismatch of characteristic impedance is caused, with the result that reflection loss of a high-frequency signal increases and a transmission characteristic deteriorates.
Hence, as a technique of matching characteristic impedance of the connections of the line conductors and the through conductor, such a technique that, by widening intervals between the line conductors and the surrounding same plane ground conductors in proximity to the connections to the through conductor, decreases stray capacities to enable matching of characteristic impedance of the connections of the line conductors and the through conductor and enable improvement of a high-frequency signal transmission characteristic is proposed, for example (refer to Japanese Unexamined Patent Publication JP-A 2000-100993 (2000)).
However, the aforementioned conventional high-frequency wiring board has such a problem that in a case where the intervals between the line conductors and the surrounding same plane ground conductors are widened in proximity to the connections to the through conductor, a wavelength of a high-frequency signal is short in a frequency band such as a microwave band and a millimeter waveband, the connections of the line conductors and the through conductor are converting portions of electromagnetic field modes, and thereby unnecessary radiation of electromagnetic waves is caused from between the line conductors and the same plane ground conductors, with the result that a transmission characteristic deteriorates more as a frequency becomes higher.
SUMMARY OF THE INVENTION
The present invention was made in view of the aforementioned problem, and an object thereof is to provide a high-frequency wiring board which enables matching of characteristic impedance at a connection of a line conductor and a through conductor and inhibition of unnecessary radiation of an electromagnetic wave from between the line conductor and a same plane ground conductor and which allows obtaining a good high-frequency signal transmission characteristic even in a high-frequency band such as a microwave band and a millimeter waveband.
The invention provides a high-frequency wiring board comprising:
a first line conductor which is formed on a main face of one dielectric layer of a dielectric board formed of a lamination of a plurality of dielectric layers so that one end thereof exists within the main face of the one dielectric layer;
a second line conductor which is formed on a main face of another dielectric layer in substantially parallel with and in alignment with the first line conductor so that one end thereof opposes to the one end of the first line conductor in a vertical direction;
a through conductor which is formed so as to pierce the dielectric layers and electrically connects the one end of the first line conductor to the one end of the second line conductor; and
a same plane ground conductor which is formed at a predetermined interval around the first and/or second line conductor,
wherein W1>W2 and S1≧S2 are satisfied in which W1 is a line width of a portion of the first and/or second line conductor surrounded by the same plane ground conductor, W2 is a conductor width of a portion of the first and/or second line conductor in proximity to a connection of the one end of the first and/or second line conductor to the through conductor, S1 is an interval between the portion having the line width W1 of the first and/or second line conductor and the same plane ground conductor, and S2 is an interval between the portion of the first and/or second line conductor in proximity to the connection to the through conductor and the same plane ground conductor.
The invention provides a high-frequency wiring board comprising:
a dielectric board consisting of one dielectric layer;
a first line conductor disposed on one main face of the dielectric board, the first line being formed such that one end of the first line conductor exists in the one main face;
a second line conductor disposed on another main face opposite the one main face of the dielectric board, the second line conductor being formed substantially in a line and substantially in parallel with the first line conductor so that one end of the second line conductor opposes to the one end of the first line conductor at a distance in a thickness direction of the dielectric board;
a through conductor formed so as to pierce the dielectric board, for electrically connecting the one end of the first line conductor to the one end of the second line conductor; and
a same plane ground conductor formed at a predetermined interval around the first and/or second line conductor,
wherein W1>W2 and S1≧S2 are satisfied in which W1 is a width of a line portion of the first and/or second line conductor having a predetermined characteristic impedance, W2 is a width of a portion of the first and/or second line conductor in proximity to a connection of the one end of the first and/or second line conductor to the through conductor, S1 is an interval between the line portion of the first and/or second line conductor and the same plane ground conductor, and S2 is an interval between the portion of the first and/or second line conductor in proximity to the connection to the through conductor and the same plane ground conductor.
The invention provides a high-frequency wiring board comprising:
a dielectric board formed of a lamination of a plurality of dielectric layers;
a first line conductor disposed on one main face of one of the plurality of dielectric layers, the first line being formed such that one end of the first line conductor exists in the one main face;
a second line conductor disposed on one main face of another one of the plurality of dielectric layers, the second line conductor being formed substantially in a line and substantially in parallel with the first line conductor so that one end of the second line conductor opposes to the one end of the first line conductor at a distance in a lamination direction of the dielectric layers;
a through conductor formed so as to pierce the dielectric board, for electrically connecting the one end of the first line conductor to the one end of the second line conductor; and
a same plane ground conductor formed at a predetermined interval around the first and/or second line conductor,
wherein W1>W2 and S1≧S2 are satisfied in which W1 is a width of a line portion of the first and/or second line conductor having a predetermined ch
Hogan & Hartson
Kyocera Corporation
Le Thanh-Tam
Nasri Javaid H.
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