Electroless gold plating solutions

Details Electroless gold plating solutions Electroless gold plating solutions

1988-06-30

1990-04-24

Morris, Theodore

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 123, C23C 302, C23C 1600

Patent

active

049197207

ABSTRACT:
Electroless or autocatalytic gold plating solutions having increased stability through the use of a non-aqueous solvent, preferably ethylene glycol, in an amount of between 50 and 100% of the base solution. Also, the excess free cyanide content of this solution can be controlled at optimum levels by periodic additions of a strong inorganic oxidant such as sodium hypochlorite without adversely affecting the other solution components.

REFERENCES:
patent: 3700649 (1972-10-01), Okinaka
patent: 3917885 (1975-11-01), Baker
patent: 3963500 (1976-06-01), Flowers et al.
patent: 4337091 (1982-06-01), El-Shazly et al.
Ali et al., "A Review of Electroless Gold Deposition Processes," Gold Bull., vol. 17, No. 4 (1984), pp. 118-127.
Okinaka, "An Electrochemical Study of Electroless Gold-Deposition Reaction," J. Electrochem. Socl, 161.120, No. 6 (1973), pp. 739-744.
Matsuoka et al., "Heavy Deposition of Electroless Gold," Plating and Surf. Fin., May, 1988, pp. 102-106.
Metal Finishing Guidebook Directory (1984), p. 824, Table VII.

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