Method and apparatus for analyzing a fabrication line

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36446817, 36446816, 36446822, 438 7, 438 14, G06F 1900, G06F 766

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059403004

ABSTRACT:
Measurement result data obtained by the devices (A1 to A8) are stored in databases (C1 to C8). Every time new data are entered in any of the databases (C1 to C8), a database monitoring computer (E1) retrieves data related to the entered data from the data stored in the databases (C1 to C8) and stores the retrieved data in a failure analysis database (D3). A data analysis system (D0) gives a readout from the failure analysis database (D3) to an operator. The operator can thereby judge that some nonconforming defect is found and what the cause of nonconforming defect is even while the product wafer is on a fabrication line, to make a prompt remedy against the cause of nonconforming defect. Thus, a method and an apparatus for analyzing a fabrication line can be provided, allowing a prompt remedy against the cause of nonconforming defect.

REFERENCES:
patent: 5111404 (1992-05-01), Kotani
patent: 5219765 (1993-06-01), Yoshida et al.
patent: 5240866 (1993-08-01), Friedman et al.
patent: 5245554 (1993-09-01), Tsuyama et al.
patent: 5341304 (1994-08-01), Sakamoto et al.
patent: 5598341 (1997-01-01), Ling et al.

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