Apparatus and method for removing known good die using hot shear

Details Apparatus and method for removing known good die using hot shear Apparatus and method for removing known good die using hot shear

1996-04-23

1998-01-13

Heinrich, Samuel M.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228212, H05K 330, B23K 1018

Patent

active

057070008

ABSTRACT:
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

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