Semiconductor package with integrated conical vapor chamber

Details Semiconductor package with integrated conical vapor chamber Semiconductor package with integrated conical vapor chamber

2002-04-16

2004-04-06

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S687000, C257S706000, C257S707000, C257S710000, C257S722000, C257S730000

Reexamination Certificate

active

06717246

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Technical Field of the Invention
This invention relates generally to thermal solutions for semiconductor packaging, and more specifically to thermal solutions using a vapor chamber such as in heatpipes.
2. Background Art
Semiconductor packages presently rely upon a primarily conductive model for transmitting heat from the surface of the semiconductor die to the exterior of the package. This model includes a number of interfaces, each of which drives an increase in the thermal resistance of the package.
FIG. 1
illustrates a generalized semiconductor packaging system
10
such as is known in the prior art. The system includes a package having a package bottom
12
and a package top
14
or integrated heat spreader which encompass a cavity
16
within which a semiconductor die
18
is contained. The semiconductor die is electrically connected through the package bottom to a number of pins or contacts
22
on the exterior of the packaging system. The semiconductor die is thermally interfaced to the package top with a quantity of a first thermal interface material
24
which improves thermal transfer from the die to the interior surface of the package top. The exterior surface of the package top is thermally coupled to a heatsink
26
with a quantity of a second thermal interface material (TIM)
28
. The reader will appreciate that this is a generalized and simplified view of the packaging system, for purposes of discussion.
Table 1 lists exemplary typical ratios of the various components of the aggregate thermal resistance of the system. Thermal resistance is measured in degrees Celsius per watt from the junction of the semiconductor device to the ambient air, in the case of an air-cooled system.
Thermal Component
% of Resistance
Package
49%
TIM 2
 7%
Heatsink
42%
Heatsink Variation
 2%
TOTAL
100% 
In order to achieve good thermal contact across the second thermal interface layer
28
, the heatsink is mechanically fastened to the package or to the computer chassis or motherboard (not shown), with strong springs or with bolts. This creates a large force (shown as Fn in
FIG. 1
) which is normal to the mating surfaces of the heatsink and the package top. This force is necessary to ensure a thin layer of TIM2 material with optimal thermal characteristics. However, this force can cause electrical and/or mechanical breakdown of the die, the package, connection to the package contacts, and so forth.
FIG. 2
illustrates a generalized, simplified heatpipe system
30
as is known in the prior art. The system includes a heatpipe
32
coupled to conduct heat from a hot device
34
to a cooling device
36
. The body of the heatpipe encloses a vapor chamber
38
which contains a quantity of a working fluid
40
which does not completely fill the vapor chamber. The vapor chamber may also include a wicking material
42
, which improves performance in configurations or orientations in which the working fluid is not held by gravity against the hot device end of the vapor chamber. As the hot device boils the working fluid, the working fluid vaporizes. As the vapor condenses elsewhere in the heatpipe nearer the cooling device, the significant amount of heat captured by the phase change is released, effecting an efficient thermal transfer from the hot end of the heatpipe to the cooler end. Any suitable cooling fluid can be used, such as water, alcohol, flourinert, or the like. Any suitable active or passive cooling device can be used, such as a heatsink, heat spreader, peltier device, refrigerator coil, or the like.


REFERENCES:
patent: 4823869 (1989-04-01), Arnold et al.
patent: 5653813 (1997-08-01), Benzing et al.
patent: 6166904 (2000-12-01), Kitahara et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6331730 (2001-12-01), Terasaki et al.
patent: 6369595 (2002-04-01), Farnworth et al.
patent: 6469379 (2002-10-01), Matayabas, Jr.
patent: 6535388 (2003-03-01), Garcia

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