Enhanced optical transceiver arrangement

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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Details

C359S199200

Reexamination Certificate

active

06652159

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an enhanced optical transceiver arrangement, and in particular, to an enhanced optical transceiver arrangement that can be optically coupled with an optical fiber ribbon for receiving and transmitting optical signals thereto and therefrom.
2. Background Information
Computer and communication systems are now being developed in which optical devices, such as optical fibers, are used as a conduit (also known as a wave guide) for modulated light waves to transmit information. These systems typically include a light emitter or a light detector optically connected to the optical fibers. A typical light emitter may be a so-called edge emitter, or a surface emitter, such as a vertical cavity surface emitting laser (VCSEL). A typical light detector may be a photodiode. A generic term of either a light emitter or a light detector is an “optoelectronic transducer.” A generic term for a light emitter and a light detector arrangement is an optical transceiver. The optical fibers, which collectively form a fiber-optic cable or ribbon, are typically coupled to the respective light detector and the light emitter, so that optical signals can be transmitted back and forth, for example.
As an example, optoelectronic transducers convert electrical signals to or from optical signals; the optical signals carry data to a receiver (light detector) from a transmitter (light emitter) at very high speeds. Typically, the optical signals are converted into, or converted from, the associated electrical signals using known circuitry. Such optoelectronic transducers are often used in devices, such as computers, in which data must be transmitted at high rates of speed.
The conventional light emitter allows for integrated two-dimensional array configurations. For example, the active regions of a conventional VCSEL can be arranged in a linear array, for instance 12 active regions spaced about 250 microns apart, or in area arrays, for example, 16×16 arrays or 8×8 arrays. Of course, other arrangements of the arrays are also possible. Nevertheless, linear arrays are typically considered to be preferable for use with optoelectronic transducers, since it is generally considered easier to align the optical fibers that collect the light emitted from the VCSELs in a linear array, than in an area array. Moreover, it is also possible to utilize the active regions singly, i.e., without being arranged in an array.
The optoelectronic transducers are normally located on either input/output cards or port cards that are connected to an input/output card. Moreover, in a computer system, for example, the input/output card (with the optoelectronic transducer attached thereto) is typically connected to a circuit board, for example a mother board. The assembly may then be positioned within a chassis, which is a frame fixed within a computer housing. The chassis serves to hold the assembly within the computer housing.
Typically, each optical fiber of the ribbon is associated with a respective active region. Further, it is conventional for the ends of the optical fibers of the ribbon to terminate in a fiber connector. Such fiber connectors usually have an industry standard configuration, such as the MTP® fiber connectors manufactured by US Conec, Ltd. of Hickory, N.C. However, fiber connectors having the industry standard configuration are not suitable for connecting directly with the sensitive active regions of the typical light emitters or light detectors. Should direct contact occur between the respective active regions and the fiber connector, the fiber connector would likely damage the active regions, causing the light emitter or light detector to become inoperative. It is thus conventional to space the fiber connector away from the active regions. However, as will be appreciated, by providing a space, it thus becomes desirable to provide a way of optically coupling the active regions with the fiber connector, so that the optical signals can be accurately and efficiently transmitted therebetween.
One conventional manner of optically coupling the active regions with the fiber connector is to provide a lens assembly in the space therebetween. However, lens assemblies tend to be complicated and expensive. Thus, it is also known to provide a fiber optic coupler between the active regions and the fiber connector. However, the conventional fiber optic coupler has a limited length, due to manufacturing constraints. Thus, the known fiber connectors must be positioned relatively close to the active regions, which may limit design options.
Moreover, the typical optical transceiver arrangement utilizes separate modules for both the light emitter and light detector, thus requiring a substantial amount of board space. Further, such separate modules are often difficult to assemble in the tight confines provided. Thus, it is desirable to provide an optical transceiver arrangement that does not occupy much space. Moreover, it is further desirable to provide an optical transceiver arrangement that is relatively easy to assemble and place in its desired location. Additionally, it is desirable to provide an optical transceiver arrangement in which the light emitter and the light detector are provided in the same package.
SUMMARY OF THE INVENTION
It is, therefore, a principal object of this invention to provide an enhanced optical transceiver arrangement.
It is another object of the invention to provide an enhanced optical transceiver arrangement that solves the above mentioned problems.
These and other objects of the present invention are accomplished by the enhanced optical transceiver arrangement disclosed herein.
According to one aspect of the invention, the optical transceiver arrangement is formed from a plurality of interconnected subassemblies. One of the subassemblies is a retainer assembly, which includes a retainer and a carrier assembly. The carrier assembly includes a die carrier, having opposing lands. The opposing lands have a receiving space therebetween, in which either a light emitter die chip or light detector die chip (hereinafter referred to collectively as a die chip) is disposed.
The carrier is preferably manufactured from a conductive material, so that it can serve as a ground for the die chip. For example, the carrier can be formed from copper, and be gold plated to enhance its conductivity and reduce its susceptibility to oxidation.
The carrier further has spaced apart feet, which can be attached to a further subassembly of the optical transceiver arrangement, as will be subsequently described. The feet provide a space under the carrier in which other components can be disposed.
Each land is adapted to allow an optical coupler to be attached thereto. The optical coupler is adapted to optically couple active regions of the light emitter or light detector with a fiber connector (i.e., an industry standard connector attached to an end of an optical fiber ribbon), so that optical signals can be accurately transmitted therebetween. For example, each land can be provided with a receiving hole, which receives a corresponding alignment pin of the optical coupler in a clearance type fit.
The optical coupler includes at least two plates disposed in a superposed relationship. At least one of the plates, or alternatively both of the plates, has a plurality of spaced apart narrow grooves formed in a surface thereof, each of which extends from one end face to another end face of the plates. Each of the narrow grooves has an optical fiber disposed therein, i.e., a fiber that is separate and distinct from the optical fibers of the ribbon. Further, the plate or plates may have a plurality of wide grooves formed in the surface. Each wide groove extends from a respective end face toward an intermediate portion of the plate or plates, for example. Each of the wide grooves has an alignment pin disposed therein. When the plates are joined together in the superposed relationship, the narrow grooves form through holes for the respective optical fib

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