Multi-chip package with embedded cooling element

Details Multi-chip package with embedded cooling element Multi-chip package with embedded cooling element

2002-04-11

2003-11-04

Tolin, Gerald (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S675000, C257S796000, C361S704000

Reexamination Certificate

active

06643136

ABSTRACT:

CROSS-REFERENCE TO RELATED APPLICATION
This application claims the priority benefit of Taiwan application Ser. No. 90131288, filed Dec. 18, 2001.
BACKGROUND OF THE INVENTION
1. Field of Invention
The present invention relates to a package with cooling element therein. More particularly, the present invention relates to a multi-chip package with one or more cooling elements therein.
2. Description of Related Art
In this information explosion era, electronic products are used everywhere. Due to the rapid progress in the electronic industry, innovative multi-functional personalized electronic products are come out in the market almost daily. Most electronic products are designed with the least material, the smallest dimensions and the least weight in mind. Despite the fast development of powerful miniaturized electronic products, cooling is still a major problem.
To reduce size and weight and increase functional capacity of electronic products, more than one chip is often embedded inside a single package.
FIG. 1
is a schematic cross-sectional view of a multi-chip module (MCM). As shown in
FIG. 1
, the multi-chip module
100
includes a plurality of chips
140
, a substrate
110
, a plurality of conductive wires
150
, a plurality of solder balls
190
and packaging material
180
for enclosing the chips
140
and wires
150
. The substrate
110
has a front surface
112
and a back surface
122
. The front surface
112
of the substrate
110
also has a plurality of die pads
114
and a plurality of wire contacts
116
. The wire contacts are positioned on the front surface
112
around the die pads
114
. The substrate further includes a plurality of solder ball contacts
124
on the back surface
122
. Each chip
140
has an active surface
142
and a back surface
148
. The active surface
142
of the chip
140
further includes a plurality of bonding pads
144
. The back surface
148
of the chip
140
is attached to the die pad
114
of the substrate
110
. One end of each conductive wire
150
is in electrical contact with a bonding pad
144
while the other end of the conductive wire
150
is in electrical contact with the wire contact
116
. The packaging material
180
encloses the substrate
110
, the chips
140
and the conductive wires
150
. The solder balls
190
are attached to the respective solder ball contacts
124
.
In the aforementioned multi-chip module
100
, all chips
140
are embedded inside the packaging material
180
. Since each chip contributes some heat to the package during operation, the tight packaging of chips
140
inside the module may lead to considerable heat dissipation problem relative to a single chip package. If the heat is not channeled away fast enough, the entire module may overheat resulting in chip malfunction. Hence, increasing heat-dissipating capacity is always a central issue in the production of multi-chip modules.
SUMMARY OF THE INVENTION
Accordingly, one object of the present invention is to provide a multi-chip package with embedded cooling elements for rapidly dissipating heat generated by various chips away from the package.
To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention provides a multi-chip package having one or more embedded cooling elements. The multi-chip package includes a substrate, a plurality of chips, at least one cooling element, a plurality of solder balls and packaging material. The substrate has a front surface and a corresponding back surface. The chips are attached to the front surface of the substrate and are electrically connected to the substrate. The cooling element is attached to at least one of the chips. The cooling element is fastened to the chip through thermal conductive glue. The solder balls are attached to the back surface of the substrate. The packaging material encloses the substrate, the chips and the cooling elements. According to the embodiment of this invention, a portion of the cooling element may be exposed by the packaging material or entirely embedded within the packaging material.
This invention also provides a second multi-chip package having one or more embedded cooling elements. The multi-chip package includes a lead frame, at least one first chip, at least one second chip and at least one cooling element and packaging material. The lead frame includes a die pad and a plurality of leads. The leads surround the die pad. The die pad has a die pad surface that corresponds to the backside of a chip. Each lead is further divided into an inner lead section and an outer lead section. The first chip is attached to the front surface of the die pad and electrically connected to some of leads. The second chip is attached to the back surface of the die pad and electrically connected to some other leads. The cooling element is attached to the upper surface of the first chip or the second chip. The cooling elements are bonded to the upper surface of the chip through thermal conductive glue. The packaging material encloses the die pad, the first chip, the second chip, the inner lead sections and the cooling elements. The outer lead sections of the leads are exposed. According to the embodiment of this invention, a portion of the cooling element may be exposed by the packaging material or entirely embedded within the packaging material.
Each multi-chip package encloses at least two chips. Hence, the package has considerable data processing power to meet future developmental demands. Moreover, the placement of cooling elements over all or some of the chips increases the heat-dissipating power of the package and reduces chip failure.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.


REFERENCES:
patent: 6246115 (2001-06-01), Tang et al.
patent: 6316822 (2001-11-01), Venkateshwaran et al.
patent: 6429513 (2002-08-01), Shermer, IV et al.
patent: 6472743 (2002-10-01), Huang et al.
patent: 6507107 (2003-01-01), Vaiyapuri
patent: 6528882 (2003-03-01), Ding et al.
patent: 2002/0079567 (2002-06-01), Lo et al.
patent: 2002/0185734 (2002-12-01), Zhao et al.
patent: 2003/0047798 (2003-03-01), Halahan
patent: 2003/0057545 (2003-03-01), Shim et al.

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