Mail solicitation package assembly

Package making – Methods – Envelope or triangular flap fold

Patent

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Details

53411, 53569, 493216, B65B 1148, B65D 2700

Patent

active

055071317

ABSTRACT:
A mailed business-solicitation letter personalized with an intended recipient's address at one selected location and his/her name at a second selected location, which is embodied in a cardboard mailing enclosure to provide an external display of the mailing address to assist in the delivery thereof and to present the name as a personalized salutation of the letter, to thereby contribute to obviating the stigma of unsolicited "junk" mail.

REFERENCES:
patent: 3618284 (1971-11-01), Gendron
patent: 3656684 (1972-04-01), Meehan
patent: 4071997 (1978-02-01), Gunther, Jr. et al.
patent: 4189895 (1980-02-01), Volkert et al.
patent: 4531993 (1985-07-01), Bradley
patent: 4828104 (1989-05-01), Ribellino, Jr.
patent: 4925086 (1990-05-01), Stahlman

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