Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1996-04-09
1999-08-17
Everhart, Caridad
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257784, 257786, 438612, 438622, H01L 2348, H01L 2160
Patent
active
059397900
ABSTRACT:
Pad structures for an integrated circuit are provided that use via holes or slots rather than large pad openings to form electrical connections between successive metal interconnection layers. The via holes or slots are filled using standard metal etchback deposition techniques. The pad structures minimize particle generation during circuit fabrication. A number of the via holes or slots in the pad structure can be interconnected in parallel to provide a sufficient current handling capacity to distribute power to the active components on the integrated circuit.
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Gregoire Francois
Madurawe Raminda
Thalapaneni Guru
Altera Corporation
Everhart Caridad
Jackson Robert R.
Treyz G. Victor
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