Method of assembling integrated circuit package

Details Method of assembling integrated circuit package Method of assembling integrated circuit package

1996-04-09

1998-01-13

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 257704, 257705, 257712, H05K 334

Patent

active

057065799

ABSTRACT:
An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contains a thermally conductive filler material. With the lid in place over the die and substrate board, the package is heated to cause the resin to flow and establish contact with the die. Further heating causes curing of the resin and a permanent thermal bridge between the die and the lid.

REFERENCES:
patent: 4939570 (1990-07-01), Bickford et al.
patent: 5349240 (1994-09-01), Narita et al.
patent: 5455457 (1995-10-01), Kurokawa
patent: 5552635 (1996-09-01), Kim et al.
IBM Tech Disclosure Bulletin vol. 20 No. 4 Sep. 1977 by D. Balderes et al, pp. 1392-1393.

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