Electric lamp and discharge devices – With gas or vapor – Three or more electrode discharge device
Reexamination Certificate
2001-08-16
2003-02-18
Patel, Vip (Department: 2879)
Electric lamp and discharge devices
With gas or vapor
Three or more electrode discharge device
C313S586000, C313S587000
Reexamination Certificate
active
06522073
ABSTRACT:
BACKGROUND OF INVENTION
1. Field of the Invention
The present invention relates to a plasma display panel (PDP), and more particularly, to a plasma display panel with an auxiliary bonding pad.
2. Description of the Prior Art
With the progressive development of the electronics industry, the demand for flat panel displays (FPD) has been increased. The plasma display panel (PDP) has the greatest market potential amongst all FPDs. In the manufacturing process of a PDP, a front substrate is sealed with a rear substrate to form lots of discharge cells therebetween. A plurality of printed circuit boards(PCBs) are then connected with the front substrate or the rear substrate for controlling these discharge cells. The printed circuit boards are used to connect with other electrical devices, so the quality of the PDP will be affected by the reliability and the bonding strength between the printed circuit boards and the front substrate (or the rear substrate).
Please refer to FIG.
1
and FIG.
2
.
FIG. 1
is a schematic diagram showing a bonding area
16
of a rear substrate
12
in a plasma display panel
10
according to the prior art.
FIG. 2
is a schematic diagram of a process for sealing the rear substrate
12
and a printed circuit board
22
in the prior art. As shown in
FIG. 1
, the plasma display panel
10
includes a front substrate (not shown) and a rear substrate
12
parallel to and spaced apart from the front substrate. A bonding area
16
is defined out of the area that the rear substrate
12
sealed with the front substrate. The bonding area
16
is connected to a printed circuit board
22
. A plurality of bonding electrodes
14
is formed on the bonding area
16
and electrically connected with the printed circuit board
22
. As shown in
FIG. 2
, a plurality of board electrodes
24
is formed on the printed circuit board. These board electrode
24
don't connect to each other. Each board electrodes
24
is positioned corresponding to one of the bonding electrodes
14
. An anisotropic conductive film(ACF)
26
, having conductive particles, fills the space between the rear substrate
12
and the printed circuit board
22
so as to connect the rear substrate
12
with the printed circuit board
22
electrically and physically.
Please refer to FIG.
3
.
FIG. 3
is a schematic diagram of the sealing structure of the rear substrate
12
and the printed circuit board
22
. At the final step of the sealing process, a layer of silicon paste
29
is coated between the rear substrate
12
and the printed circuit board
22
. The silicon paste
29
is used to protect the ACF
26
from the air and to strengthen the connection between the rear substrate
12
and the printed circuit board
22
. However, in the PDP
10
formed by the prior art method, a space
27
is usually formed between the ACF
26
and the front end of the bonding electrode
14
, and therefore an inner silicon paste
291
fails to contact with the substrate
12
or the board electrodes
24
. Thus, the inner silicon paste
291
fails to adhere the rear substrate
12
to the printed circuit board
22
. Besides, after the silicon paste
29
is formed, the moisture may exist in the air of the space
27
. This moisture will influence the bonding properties of the ACF
26
so that the ACF
26
may be peeled off from the bonding electrodes
14
or the board electrodes
24
. Therefore, the bonding electrodes
14
and the board electrodes
24
may fail to remain electrically connected, or the moisture may reduce the bonding effect of the silicon paste
29
, so the reliability of the PDP is affected.
SUMMARY OF INVENTION
It is therefore an object of the present invention to provide a plasma display panel (PDP) having an auxiliary bonding pad to solve the above-mentioned problems.
According to the present invention, a plasma display panel includes a substrate and a printed circuit board. The substrate has an edge, and a plurality of bonding electrodes are formed on the substrate along the edge of the substrate. Each bonding electrode neither overlaps with any of the other bonding electrodes nor electrically connects to any of the other bonding electrode. The bonding electrodes are spaced from the edge of the substrate by a distance. Further, a plurality of board electrodes is formed on the printed circuit board. Each board electrode neither overlaps nor connects to any of the other bonding electrode. The position of each board electrode corresponds to the position of a corresponding bonding electrode. Beside, an auxiliary bonding pad is formed between the bonding electrodes and the edge of the substrate. When a conductive adhesive layer and a protective adhesive layer are formed to adhere the substrate with the printed circuit board, the auxiliary bonding pad can reduce a space formed between the bonding electrodes and the conductive adhesive layer, and also eliminates the possibility of the bubble formation therebetween. Therefore, the substrate is completely sealed with the printed circuit board.
Chen Po-Cheng
Li Chien-Hsing
Wu Jiun-Han
AU Optronics Corp.
Hsu Winston
Patel Vip
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