Apparatus detecting an IC defect by comparing electron emissions

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324750, G01R 3128

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active

058217614

ABSTRACT:
Test patterns are applied to an IC under test under a test pattern address by which the first fail is caused and under other test pattern addresses. A defect candidate area is moved to the position where a charged particle beam can scan the area and defect candidate wiring portions are specified. A potential data of the specified wiring is acquired for each of the test patterns and stored in a memory. This process is process performed by sequentially stepping back the stop test pattern addresses. Then, a potential data of the specified wiring in thee specified area is similarly acquired for non-defect IC. The respective potential data of the IC under test and the non-defect IC are compared to locate the mismatch test pattern address and wiring.

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