Heat dissipating device and computer

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S697000, C361S704000, C165S080300, C165S121000, C165S185000, C174S016300, C257S722000

Reexamination Certificate

active

06657860

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink, a cooling member, a semiconductor-substrate cooling system, a computer, and a radiation method, and more particularly to an apparatus, method and system for efficiently radiating heat generated in a CPU, or the like, of a computer.
2. Description of Related Art
As is known, because a temperature rise of a central processing unit (hereafter referred to as CPU) of a computer is directly related to the performance of the CPU, it is often desirable to attempt to diffuse the heat generated in the CPU and cool the CPU.
To improve cooling of the CPU, it is often necessary to increase the size of a radiating portion to be situated in relation to the CPU so as to contact to allow heat transfer. It is also known to position a fan in close proximity to the CPU such that the fan may provide air flow to a radiating portion, and/or the rotational speed of the fan may be increased to increase air flow. However, each of these options, increasing the size of the radiating portion and the fan, and increasing the rotational speed of the fan, are not preferred implementations as the former opposes the present trends of downsizing computer footprints and sizes, and the latter causes additional problems such as noise.
As shown in
FIGS. 9 and 10
, a heat sink
101
is set forth radiates heat generated in a CPU.
FIG. 9
is an illustration showing a structure of the heat sink
101
and
FIG. 10
is a sectional view taken along a line V—V in FIG.
9
. As shown in
FIG. 9
, the heat sink
101
is constituted by integrally forming a radiating portion
102
for radiating and diffusing the heat generated in a CPU and a centrifugal-fan-type blasting portion
103
for blasting air to the radiating portion
102
. The radiating portion
102
is provided with a substrate portion
104
formed of a flat member made of copper, a radiating fin
106
protruded to one flat face
104
a
of the substrate portion
104
, both end margins
104
b
of the substrate portion
104
, and a side-plate portion
107
rising from the both margin ends
104
b.
Moreover, as shown in
FIG. 10
, the radiating portion
102
is provided with an upper-plate portion
108
formed so as to cover the substrate portion
104
from the top. Therefore, as shown in
FIG. 10
, the radiating portion
102
forms a duct-like space
112
for the substrate portion
104
, side-plate portion
107
, and upper-plate portion
108
to surround the radiating fin
106
. Moreover, as shown in
FIG. 10
, the heat sink
101
is positioned so that a CPU
111
provided on the motherboard
110
of the computer directly contacts a flat face
104
c
opposite to a flat face
104
a
of the substrate portion
104
.
At the time of driving the blasting portion
103
while setting the heat sink
101
as shown in
FIG. 10
, an airflow generated by the blasting portion
103
passes through the duct-like space
112
and exhausted to the outside from the exit portion
112
a
(refer to
FIG. 10
) of the duct-like space
112
. However, the heat generated in the CPU
111
is conducted to the substrate portion
104
and moreover conducted up to the radiating fin
106
. In this case, because the substrate portion
104
and radiating fin
106
are cooled by the airflow supplied from the centrifugal fan, it is possible to diffuse the heat generated in the CPU
111
.
The centrifugal-fan-type blasting portion
103
is constituted so as to blast air in Y direction tilted by a predetermined angle from X direction which is an extending direction of the radiating portion
102
(extending direction of the duct-like space
112
) as shown in FIG.
9
. However, to maximize a radiation effect, the radiating fin
106
is formed on the entire surface of the substrate portion
104
and the air resistance along the substrate portion
104
in the duct-like space
112
is almost uniform. Therefore, at the time of driving the blasting portion
103
, a portion where an airflow occurs is restricted to a portion to which air is directly blasted from the blasting portion
103
(e.g. area a in
FIG. 9
) and air stays in a portion (e.g. area b in
FIG. 9
) deviated from the blasting direction (Y direction) viewed from the blasting portion
103
.
However, as it is difficult to completely cool the radiating fin
106
at a portion deviated from the blasting direction (Y direction) viewed from the blasting portion
103
, the cooling performance is less than that desired.
Moreover, since it is impossible to completely cool the portion deviated from the blasting direction (Y direction) as described above, a temperature rise occurs at this portion and heat is conducted up to the housing of the computer through a screwed portion
113
formed on the radiating portion
102
. For such a situation, the surface temperature of the computer housing rises and availability of a user may be lost.
SUMMARY OF THE INVENTION
Accordingly, there is a need for an apparatus, method and system that overcomes the problems discussed above. The present invention provides an apparatus, method and system having efficient cooling performance, even for a compact structure, while suppressing a temperature rise of the housing of a computer.
According to one embodiment, the present invention is a heat sink, comprising: a radiating plate for radiating heat conducted from a heat source; a ventilation area formed along said radiating plate; and a blasting fan for blasting air to said ventilation area, wherein a high-wind-pressure portion and a low-wind-pressure portion having wind pressures different from each other when air is blasted by the blasting fan are formed in the ventilation area and wind-force losing members for losing the wind pressures are provided for the ventilation area, and the wind-force losing members are densely provided for the high-wind-pressure portion compared to the low-wind-pressure portion.
In this embodiment, because the high-wind-pressure portion has a large pressure loss and the low-wind-pressure portion has a small pressure loss in the ventilation area, wind pressures in the ventilation area are averaged. Therefore, rates of airflows generated by the blasting fan are averaged in the ventilation area and as a result, an airflow is generated in any portion in the ventilation area. In this case, it is possible to use a radiating fin or the like for radiation as a wind-force-losing member.
In this embodiment, when the ventilation area is formed like a duct, the blasting direction by the blasting fan tilts by a predetermined angle from the extending direction of the ventilation area, the high-wind-pressure portion is provided in the blasting direction of the blasting fan viewed from the blasting fan, and the low-wind-pressure portion is provided in a direction other than the blasting direction viewed from the blasting fan, it is possible to set a blasting direction independently of the extending direction of the duct-like ventilation area. Additionally, as used herein, the term “duct-like” includes not only a completely cylindrical shape but also a half-duct-like shape, that is, a half-cylindrical shape.
Moreover, when the low-wind-pressure portion is provided for separate positions at the both sides of the high-wind-pressure portion viewed from a tangential line of the blasting direction to the blasting fan, an airflow along the blasting-directional tangent also moves to the low-wind-pressure side and air is blasted to both the high- and low-wind-pressure portions.
Furthermore, when a portion of the radiating plate facing the low-wind-pressure portion is flatly formed, it is possible to minimize the pressure loss of this portion. Therefore, it is possible to easily generate a pressure-loss difference between the low- and high-wind-pressure portions by providing the wind-force losing member for the only high-wind-pressure portion.
Furthermore, the present invention, in a further embodiment, is a cooling member having a cooling member body contacting a heat source and forming a duct-like structure and a plurality of radiat

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