Buckle of IC heat dissipating device

Buckles – buttons – clasps – etc. – Clasp – clip – support-clamp – or required component thereof – With specific mounting means for attaching to rigid or...

Reexamination Certificate

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Details

C024S458000, C361S704000, C174S016300, C257S718000, C165S080300

Reexamination Certificate

active

06662412

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to buckles, and particularly to a buckle of an IC heat dissipating device.
BACKGROUND OF THE INVENTION
With the advance of the central processing units (CPU) of personal computers, the heat dissipating efficiency of CPU is more and more important since overheat of a CPU will induce the reduction of heat dissipating efficiency. Moreover, the personal computer is easy to shut down. Further, the same problem may occur at other chips used as processor, such as image processing chips. To avoid this problem, some the heat dissipating technology is developed.
Referring to
FIG. 1
, it is illustrated that a conventional IC heat dissipating device approximately comprises a heat dissipating fan
10
, a heat dissipating fin device
11
, and and press buckle
12
. The bottom of the heat dissipating fin device
11
is tightly adhered to the top surface of the CPU
20
. Two ends of the press buckle
12
have hole-like ears
121
a,
121
b
for hooking the hooks
31
at two sides of the IC socket
30
. The heat dissipating fin device
11
is fixed to the surface of the CPU
20
.
In this conventional heat dissipating device, the press buckle
12
is made of elastic metal piece. The press buckle
12
is bent and then deforms so as to generate elastic force to press the IC socket. Since in normal condition, this press buckle
12
is in a bending state, in installation, an outer force is necessary to press the buckle piece
12
to deform sufficiently. Thereby, the ears
121
a,
121
b
of the press buckle
12
can hook the hooks
31
of the IC socket
30
. Then, the press buckle
12
is released. Then the press buckle
12
will buckle the IC socket
30
by the restoring elastic force of the press buckle
12
.
In assembling this conventional heat dissipating device, an outer force is necessary to press the press buckle
12
to deform. However, it is possible that the IC socket is harmed due to the carelessness of the operator. Since the outer force for installing the press buckle
12
must be larger than the force of the press buckle
12
applied to the IC socket
30
so that the two ears
121
a,
121
b
at two ends of the press buckle
12
arrive positions sufficient to hook the hooks
31
at two sides of the IC socket
30
.
SUMMARY OF THE INVENTION
Accordingly, the primary object of the present invention is to provide a buckle of an IC heat dissipating device which is safe and can be operated easily, wherein in installing the present invention, the user only needs to press an operation portion slightly, without overlarge force being applied to the central processing unit.
To achieve the object, the present invention provides a buckle of an IC heat dissipating device for installing a heat dissipating fin device to a top surface of an IC located in an IC socket; comprising: a pair of clamping arms having a first clamping arm and a second clamping arm, which are pivotally connected; the clamping arms are bent with one ends thereof being pivotally connected and another ends thereof have respective ears for hooking the hooks at two sides of the IC socket; a supporting frame being fixed to a top of the heat dissipating fin device; and an operation rod having a camshaft and a lever for rotating the camshaft. The camshaft passes through the supporting frame and is capable of rotating freely on the supporting frame. By rotating the lever, the camshaft rotates to an operational position and a releasing position. In operation position, the cam of the camshaft will eject the pivotal connection of the clamping arms and the clamping arms will bend and deform. By the restoring forces of these clamping arms, the ears at two ends of the clamping arms have sufficient forces to hook the hooks at two sides of the IC socket.
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.


REFERENCES:
patent: 5477916 (1995-12-01), Lin
patent: 5493475 (1996-02-01), Lin
patent: 5835347 (1998-11-01), Chu
patent: 6332251 (2001-12-01), Ho et al.
patent: 6449154 (2002-09-01), Yoneyama et al.
patent: 6449157 (2002-09-01), Chu
patent: 6473306 (2002-10-01), Koseki et al.

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