Microencapsulatable solvent adhesive composition and method for

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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523210, 4284022, 428518, C08K 910

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active

058212930

ABSTRACT:
A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.

REFERENCES:
patent: 2988461 (1961-06-01), Eichel
patent: 3814156 (1974-06-01), Bachmann et al.
patent: 4672084 (1987-06-01), Dierdorf et al.
patent: 5416142 (1995-05-01), Bush et al.

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