Multiple LED chip package

Details Multiple LED chip package Multiple LED chip package

2001-08-27

2003-06-24

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S081000, C257S703000, C257S713000, C257S724000

Reexamination Certificate

active

06583447

ABSTRACT:

BACKGROUND OF THE INVENTION
(1) Field of Invention
This invention relates to light emitting diodes (LED), particularly to packages for multiple LED chips. The package is also applicable to optical devices, such as laser diodes, etc.
(2) Brief Description of Related Art
FIG. 1
shows a prior art package for a single LED. A cup
16
is recessed in a substrate
15
. The bottom and the wall of the cup is coated with a layer of metal
11
. The LED chip
10
is mounted on the bottom of the cup
16
. The top electrode of the LED chip
10
is wire-bonded to the metallic plate
12
for extension connection. The bottom electrode of LED
10
is in contact with the metallic layer
11
which is extended to provide another external connection.
FIG. 2
shows the side view of FIG.
1
.
The cup shaped structure shown in
FIGS. 1 and 2
has only one cup and is incapable of accommodating multiple number of chips in one package.
SUMMARY OF THE INVENTION
An object of this invention is to provide a package capable of packaging multiple number of LED chips.
The object is achieved by inscribing a groove in the package so that more than one LED chips can be mounted in the groove.


REFERENCES:
patent: 6060729 (2000-05-01), Suzuki et al.
patent: 6180962 (2001-01-01), Ishinaga
patent: 6281524 (2001-08-01), Yamamoto et al.

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