Pin standing resin-made substrate, method of making pin...

Details Pin standing resin-made substrate, method of making pin... Pin standing resin-made substrate, method of making pin...

2001-04-10

2003-12-09

Talbott, David L. (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C029S844000

Reexamination Certificate

active

06660946

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a pin standing (pin grid array) resin substrate having the pins as input/output terminals erected thereon, a making method of the pin standing resin substrate, a pin as an input/output terminal for use in the pin standing substrate, and a making method of this pin, and more particularly to a pin standing resin substrate with an increased bonding strength between the pin and the resin substrate, a making method of the pin standing resin substrate, a pin capable of increasing the bonding strength with the resin substrate, and a making method of the pin.
2. Description of the Related Art
Conventionally, a pin standing resin substrate was known having the pins as input/output terminals standing on the resin substrate made of resin or a composite material containing resin.
For example, there is a pin standing resin substrate
201
as shown in a partly enlarged cross sectional view of FIG.
15
. This pin standing resin substrate
201
is constituted of a resin substrate
203
having an almost (substantially) rectangular and substantially laminar (plate-like) shape and a number of pins
221
standing thereon.
The resin substrate
203
has a resin insulating layer
205
with a wiring layer (not shown) formed inside or on the surface, with a number of pin-pads
209
exposed from a solder resist layer
207
being formed on the side of a main surface
203
A (upward in the figure).
On the other hand, a pin
221
is made of 194 alloy, for example, and comprises a rod-like portion
221
A of substantially cylindrical shape and an enlarged diameter portion
221
B like a substantial disk formed at the end of the pin-pad
209
. And the pin
221
is fixed to the resin substrate
203
by bonding the whole of the enlarged diameter portion
2211
and a part of the rod-like portion
221
A on the side of the enlarged diameter portion
221
B with the pin-pad
209
by solder HD. The pin
221
may be made of copper base metal such as pure copper, phosphor bronze, german silver and beryllium bronze, or iron base metal such as kovar (Fe—Ni—Co alloy) and 42 alloy (Ni(42 wt %)-Fe alloy), as well as 194 alloy.
However, such pin standing resin substrate
201
may be broken in a junction part when a stress is applied on the pin
221
, because the bonding strength between the pin
221
and the pin-pad
209
is weak.
SUMMARY OF THE INVENTION
This invention has been achieved in the light of the above-mentioned problem, and it is an object of the invention to provide a pin standing resin substrate unlikely to break down due to a stress being applied on the pin, a making method of the pin standing resin substrate, a pin for use in the pin standing substrate, and a making method of the pin.


REFERENCES:
patent: 4675243 (1987-06-01), Obinata et al.
patent: 5484964 (1996-01-01), Dawson et al.
patent: 6307161 (2001-10-01), Grube et al.
patent: 6376782 (2002-04-01), Kimura et al.
patent: 63-272061 (1988-11-01), None
patent: 6-21312 (1994-01-01), None
patent: 08-191126 (1996-07-01), None
patent: 2000-049252 (2000-02-01), None
patent: 2000-164786 (2000-06-01), None

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