Method and apparatus for laser soldering of microelectronic lead

Details Method and apparatus for laser soldering of microelectronic lead Method and apparatus for laser soldering of microelectronic lead

1992-10-13

1993-12-21

Albritton, C. L.

Electric heating

Metal heating

By arc

21912185, 219 8513, B23K 2600

Patent

active

052723070

ABSTRACT:
This invention relates to an method and apparatus for soldering microelectronic lead connections to pads on a ceramic substrate with the aid of a fiber based Neodymium:yttrium-aluminum-garnet (Nd:YAG) laser. Such structures of this type, generally, provide a means of delivering sufficient localized heating to the ceramic substrate to reflow solder plate or melt solder cream (paste) within the lead connection without any substrate preheating.

REFERENCES:
patent: 4547652 (1985-10-01), Raisig et al.
patent: 5175410 (1992-12-01), Freedman et al.

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