Semiconductor device having external connection terminals provid

Details Semiconductor device having external connection terminals provid Semiconductor device having external connection terminals provid

1996-06-17

1999-02-23

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257666, 257676, 257737, 257778, 257692, 257738, 257789, 257792, 438124, 361813, H01L 2348, H01L 2312, H01L 2352

Patent

active

058747842

ABSTRACT:
A semiconductor device includes an interconnection plate, a semiconductor chip having electrodes formed on one surface thereof and bonded to the interconnection plate with the other surface thereof, wires respectively connecting the electrodes of the semiconductor chip and the internal connection regions of the interconnection plate, and a resin sealer sealing therein the semiconductor chip and the wires on the interconnection plate, wherein the internal connection regions are provided in a peripheral area of the interconnection plate surrounding the semiconductor chip, and major portions of the interconnection patterns and the external connection terminals are provided in an area inward from the internal connection regions under the semiconductor chip.

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patent: 5506756 (1996-04-01), Heley
patent: 5552631 (1996-09-01), McCormick
patent: 5581122 (1996-12-01), Chao et al.
patent: 5592025 (1997-01-01), Clark et al.
patent: 5625222 (1997-04-01), Yoneda et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5656550 (1997-08-01), Tsuji et al.
patent: 5663593 (1997-09-01), Mostafazadeh et al.
patent: 5672912 (1997-09-01), Hoki et al.

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