Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1997-04-30
1999-02-23
Jackson, Jerome J.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257669, H01L 2348
Patent
active
058747737
ABSTRACT:
The resin-sealed package includes a lead frame having a supporting and heat spreading pad and inner and outer leads arranged to surround the supporting and head spreading pad. A tape automated bonding (TAB) structure is provided having a semiconductor chip having bonding pads formed on a periphery of a main surface of the semiconductor chip. A rear surface of the semiconductor chip is fixed to the supporting and head spreading pad. TAB leads are provided on the main surface of the semiconductor chip. One end of each TAB lead is connected with said bonding pads and the other end of each TAB lead is connected with one end of each inner lead of the lead frame. A resin molding is used for sealing the TAB structure and the supporting and head spreading pad and inner leads of the lead frame. An area of the supporting and head spreading pad is larger than that of the semiconductor chip of said TAB structure. The supporting and heat spreading pad includes a first slit positioned under the semiconductor chip and a second slit positioned outside of the semiconductor chip in a plane view.
REFERENCES:
patent: 4732733 (1988-03-01), Sakamoto et al.
patent: 4797726 (1989-01-01), Manabe
patent: 4809053 (1989-02-01), Kuraishi
patent: 4884124 (1989-11-01), Mori et al.
patent: 4918511 (1990-04-01), Brown
patent: 4952999 (1990-08-01), Robinson et al.
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5233222 (1993-08-01), Djennas et al.
patent: 5289032 (1994-02-01), Higgins, III et al.
patent: 5304843 (1994-04-01), Takubo et al.
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5397915 (1995-03-01), Nose
patent: 5554885 (1996-09-01), Yamasaki et al.
patent: 5661338 (1997-08-01), Yoo et al.
patent: 5708294 (1998-01-01), Toriyama
patent: 5712507 (1998-01-01), Eguchi et al.
Nikkei Micro Device, Nikkei BP Co., May 1991, pp. 94-99.
Nikkei Electronics, Nikkei BP Co., Jan. 21, 1991, pp. 132-136.
Suzuki Kazunari
Terada Kazuhiro
Tsubosaki Kunihiro
Watanabe Hiroshi
Hardy David B.
Hitachi , Ltd.
Hitachi Microcomputer System Ltd.
Jackson Jerome J.
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