Method for fabricating a stacked capacitor for dynamic random ac

Details Method for fabricating a stacked capacitor for dynamic random ac Method for fabricating a stacked capacitor for dynamic random ac

1995-04-14

1996-01-16

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437 60, 437919, H01L 2170, H01L 2700

Patent

active

054847443

ABSTRACT:
The present invention provides a method of fabricating a DRAM cell capacitor having an improved capacitance by increasing the surface area of the electrode plate. First, a first insulating layer, a second insulating layer, and a barrier layer are formed sequentially on a semiconductor substrate having source/drain regions. Next, a portion of the barrier layer is etched to form a first contact opening over one of the source/drain regions. A first sidewall spacer is formed on the sidewall of the first contact opening of the barrier layer. Similarly, a second contact opening is formed by etching the second insulating layer using the barrier layer and the first sidewall spacer as a mask, and a second sidewall spacer is formed on the sidewall of the second contact opening of the second insulating layer. Then, a third contact opening is formed by etching the first insulating layer using the first sidewall spacer, the second sidewall spacer, and the second insulating layer as a mask, meanwhile the barrier layer is also removed. After removing the second sidewall spacer, a first electrode plate is formed overlying the exposed surfaces of the first sidewall spacer, the second insulating layer, the first insulating layer, and the semiconductor substrate. Hence, the first electrode plate is connected to one of the source/drain regions through the third contact opening. Finally, a dielectric layer is formed on the first electrode plate, and a second electrode plate is formed on the dielectric layer to complete the capacitor fabrication.

REFERENCES:
patent: 5223448 (1993-06-01), Su
patent: 5346847 (1994-09-01), Jun
patent: 5352621 (1994-10-01), Kim et al.

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