Substrate mounted connector assembly for interconnecting externa

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

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Details

439607, H01R 909

Patent

active

058203907

ABSTRACT:
A first connector 30 mounted on an upper surface of a substrate 10 has a first contact 38 which contacts with a card 32 inserted from one end and extends through a through hole 22 of the substrate 10 at the other end. The first contact 38 is supported by the first connector 30 in a distant position from the substrate 10, and a connecting portion 38c thereof and the through hole 22 are spaced apart. A second connector 60 has a second contact 66 which contacts with an external connector 90 inserted from one end and the connecting portion 38c of the first contact 38 inserted from the other end. The substrate 10, the first and second connectors 30 and 60 are connected each other by connection between the connecting portion 38c and a spring 66c.
The first and second connectors 30 and 60 include shield shells 40 and 68 covering the first and second connectors 30 and 60, respectively, and the shield shells 40 and 68 are maintained in the same electric potential through a ground electrode of the substrate 10 to effectively prevent unwanted emission caused by a ground potential difference between connectors.

REFERENCES:
patent: 5006080 (1991-04-01), Ichitsubo et al.
patent: 5176526 (1993-01-01), Hillbish et al.
patent: 5316487 (1994-05-01), Clark

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