Ventilation – Electronic cabinet
Reexamination Certificate
2001-07-30
2003-05-20
Boles, Derek S. (Department: 3749)
Ventilation
Electronic cabinet
C055S385400
Reexamination Certificate
active
06565428
ABSTRACT:
BACKGROUND OF THE INVENTION
1) Field of the Invention
The present invention relates to a heat dissipation device, the said heat dissipation device having an effectively reduced industrial computer installation height; as well, the heat dissipation device achieves the efficient heat dissipation of chips in computers.
2) Description of the Prior Art
In a conventional industrial computer heat dissipation device
3
, as indicated in
FIG. 12
,
FIG. 13
, and
FIG. 14
, the heat dissipation device
3
is comprised of a duct flow-type fan
30
and a heat sink
40
, wherein the duct flow-type fan
30
is equipped with an outer enclosure
37
and, also, the outer enclosure
37
has at its exterior periphery a plurality of insertion holes
35
in raised sections
34
, the outer enclosure
37
also supports a motor
36
having a plurality of blades
33
, and the said duct flow-type fan
30
has an axially oriented intake port
31
and exhaust port
32
; the heat sink
40
has a base
41
, with the base
41
having extending upward from one side a plurality of arrayed heat dissipation fins
42
, the space in between every two fins
42
constituting a ventilation channel
43
; formed horizontally across the center of the fins
42
is a vacant channel
43
(depicted in
FIG.13
by the dashed line) and the spatial contiguity of each fin
42
is disrupted at the vacant channel
43
.
The duct flow-type fan
30
is fastened onto the fins
42
of the heat sink
40
utilizing a plurality of screws (not shown in the drawings) placed into the insertion holes
35
and the lower extent of the base
41
is installed against chip (not shown in the drawings) to dissipate heat. When the fan
30
is placed in circuit and powered into rotation, an air current from the upper extent is admitted into the intake port
31
of the fan
30
and then blown out of the exhaust port
32
towards the heat sink
40
(see the arrowhead in FIG.
14
), passing through the ventilation channels
44
before discharge outside (see the arrowhead in FIG.
13
), the resulting air convection absorbing the chip heat source via the fins
42
to achieve the objective of heat dissipation.
However, since intake and exhaust of the duct flow-type fan
30
occurs along a single axial line, the fan
30
requires at its upper extent an appropriate space serving as an air intake height and since the air intake height is one-fourth the horizontal width D of the fan
30
(i.e., D/4, a number lower than this defined value will affect fan air intake efficiency), installation in an industrial computer must take into account the total height H (see
FIG. 14
) of the heat dissipation device
3
, which is the air intake height (D/4) as well as the heights of the fan
30
and the heat sink
40
. When utilizing industrial computer height in
1
U (
1
U=4.44 mm), air intake height must be allowed for without having to reduce fan
30
or heat sink
40
height, otherwise chip heat dissipation efficiency will be decreased; furthermore, the fan
30
wind force is blown from the top downward onto the base
41
, with the back pressure of the axially oriented wind force resulting in high air current resistance will therefore prevent the generation of the optimal air convection needed for heat dissipation efficiency; to achieve air convection efficiency; and the horizontally oriented open channel
43
formed reduces the heat dissipating area of the fins
42
and subsequently also decreases heat dissipation efficiency.
SUMMARY OF THE INVENTION
The present invention herein provides a duct flow-type fan that comprises of a housing having upper and lower side walls as well as a laterally oriented air port, a motor, a vane, and a shaft; the housing is installed at side of a computer chip heat sink, the motor and vane are respectfully positioned at the front and rear sides of the housing and, also, the axial centers of the motor and the vane are conjoined at the two ends of the shaft; the rotation of the motor revolves the shaft, thereby impelling the vane into rotation such that vane air current travels through the laterally oriented air port to cool the computer chip heat sink and in doing so achieve the objective of computer chip heat dissipation; since the overall height of the duct flow-type fan and heat sink of the present invention herein following assembly is lower than the height of the heat sink and does not require additional air intake height, the low height feature is usable for industrial computer applications (such as personal computers, power supplies, and other limited form factor devices); furthermore, the air convection method of the duct flow-type fan invention herein does not generate back pressure, therefore, the air convection current is optimal and provides for maximum heat dissipation efficiency.
REFERENCES:
patent: 2399384 (1946-04-01), Pross
patent: 2825500 (1958-03-01), McLean
patent: 3911953 (1975-10-01), Crombie et al.
patent: 4178092 (1979-12-01), Yamamoto et al.
patent: 5210680 (1993-05-01), Scheibler
patent: 5562410 (1996-10-01), Sachs et al.
patent: 5657641 (1997-08-01), Cunningham et al.
patent: 5876278 (1999-03-01), Cheng
patent: 6104607 (2000-08-01), Behl
patent: 6400568 (2002-06-01), Kim et al.
Bacon & Thomas
Boles Derek S.
ElanVital Corporation
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