Method of forming bonding bumps by punching a metal ribbon

Details Method of forming bonding bumps by punching a metal ribbon Method of forming bonding bumps by punching a metal ribbon

1991-10-17

1994-01-04

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437188, 437202, 437204, 228254, 22818021, 29845, H01L 21283, H01L 21603

Patent

active

052759709

ABSTRACT:
Disclosed is a method of forming bonding metal bumps on electrodes of a submount for use with an optical device array. Small bonding metal pieces are arranged on a transfer piece resting substrate so as to be aligned with the electrodes of the submount. Next, the bonding metal pieces thus arranged are transferred onto respective electrodes of the submount. In one embodiment, bonding metal pieces are preferably formed by punching a ribbon-shaped bonding metal and respectively fixed by a force of the punching operation directly onto the electrodes of the submount.

REFERENCES:
patent: 3719981 (1973-03-01), Steitz
patent: 4693770 (1987-09-01), Hatada
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 4906823 (1990-03-01), Kushima et al.
patent: 5118370 (1992-06-01), Ozawa
Webster's Ninth New Collagiate Dictionary, Merriam Webster Inc., 1985. p. 1004.
Katsura et al., "A Micro Interconnection Technique Using Solder Bumps For High-Speed Optical Devices", IMC 1990 Proceedings, pp. 105-108 (1990).

Affiliated with

Also associated with

Rating

Method of forming bonding bumps by punching a metal ribbon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming bonding bumps by punching a metal ribbon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming bonding bumps by punching a metal ribbon will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-306731