Transparent, electroconductive substrate and method for forming

Details Transparent, electroconductive substrate and method for forming Transparent, electroconductive substrate and method for forming

1995-03-20

1997-09-02

Utech, Benjamin

Coating processes

Electrical product produced

Metallic compound coating

4271263, 427240, 4273762, 427427, 4274432, B05D 512

Patent

active

056629621

ABSTRACT:
A transparent, electroconductive ink having therein ultra-fine ITO particles dispersed in a solvent or in a solvent containing a resin dissolved therein is coated and dried on a transparent support, then dried and optionally baked, and thereafter an overcoating liquid consisting essentially of silica sol is coated over the resulting transparent, electroconductive film formed on the support. This is then dried and optionally baked to obtain a transparent, electroconductive substrate having a specific resistance of 0.01 to 0.5 .OMEGA..cm, a haze value of 0 to 2%, and a volume content of the ultra-fine ITO particles in the film of being 40 to 75%. The substrate has a small surface resistivity and has excellent optical characteristics and weather resistance.

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patent: 5395678 (1995-03-01), Matsushima et al.
patent: 5411792 (1995-05-01), Yukinobu et al.
patent: 5421926 (1995-06-01), Yukinobu et al.

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