Integrated semiconductor circuit with an increased operating...

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Amplitude control

Reexamination Certificate

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Details

C327S328000

Reexamination Certificate

active

06535046

ABSTRACT:

BACKGROUND OF THE INVENTION
FIELD OF THE INVENTION
The present invention relates to an integrated semiconductor circuit having NMOS transistors which are at an increased operating voltage in a corresponding operating mode.
Integrated semiconductor circuits often have programmable elements for permanently storing data. In the case of integrated memory circuits, these may be in particular, electrically programmable elements which, by way of example, serve for storing repair information with regard to repairing defective memory cells. The programmable elements can be programmed at the end of the process for fabricating the integrated circuit by an application of a so-called burning voltage.
For the purpose of programming the electrically programmable elements, a burning voltage having a high potential level is applied to the circuit in a corresponding operating mode, for example externally or internally by an additional circuit. The operation for programming the programmable elements is in this case effected by a high voltage or a high current, which leads to permanent alteration of the conductor track resistance, for example causing a corresponding electrical fuse to melt or an insulator to break down (so-called antifuse).
As a result of the burning voltage being applied to a circuit for programming a programmable element, high potential differences occur across the circuit and, in some instances, across other circuits connected thereto. In order to withstand the potential differences, which are considerably increased in comparison with unaffected circuit sections of the integrated circuit, it is necessary for those circuit elements of the relevant circuit which are at the increased voltage to be given adequate dimensions. With the application of recent technologies with decreasing feature sizes and smaller gate oxide thicknesses, it is generally no longer possible to configure the affected circuit elements such that they can withstand the increased potential difference.
Integrated semiconductor circuits often contain transistors using NMOS technology. NMOS transistors are usually made in a substrate with a base doping of a p-conductivity type. Accordingly, it contains zones with drain terminals and source terminals with a respective doping of an n-conductivity type and also a channel with a gate terminal. Situated in the substrate beneath the channel there is often a fourth terminal of the transistor, which is also referred to as a bulk terminal. The substrate in which the NMOS transistor is made is usually connected to a fixed reference-ground potential of the integrated circuit. If the transistor is not electrically insulated from the rest of the substrate of the integrated circuit, its bulk terminal is, accordingly, likewise at the reference-ground potential. If, for example, the burning voltage mentioned above is applied to one of the other terminals of the transistor, the transistor may incur permanent damage on account of the increased potential difference between the corresponding terminal of the transistor and the bulk terminal thereof. The semiconductor circuit generally manifests a functional error as a consequence.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide an integrated semiconductor circuit with an increased operating voltage that overcomes the above-mentioned disadvantages of the prior art devices of this general type, which contains a transistor of the NMOS type and protects against damage, the transistor which is at an increased input voltage or supply voltage in a corresponding operating mode.
With the foregoing and other objects in view there is provided, in accordance with the invention, an integrated semiconductor circuit containing a substrate of a p-conductivity type. A well of the p-conductivity type is disposed in the substrate and electrically insulated from the substrate, and the well also has a well terminal. An NMOS transistor is disposed in the well. A control circuit having a terminal for an output signal whose potential can be altered by the control circuit is provided. The terminal for the is output signal is connected to the well terminal.
The integrated semiconductor circuit has a transistor of the NMOS type that is disposed in the well of the p-conductivity type, which well, for its part, is disposed in the substrate of the p-conductivity type. The well is electrically insulated from the substrate, this being achieved during fabrication for example by a so-called buried well process. The semiconductor circuit furthermore has a control circuit with an output signal whose potential can be altered by the control circuit. A well terminal of the well is connected to the output signal of the control circuit. The well terminal forms the bulk terminal of the transistor. The provision of the control circuit thus makes it possible to influence the potential of the well (bulk potential) in such a way that the potential difference between the well and the remaining terminals of the transistor is small enough to protect the transistor against damage.
As a result of the deliberate intervention in the bulk potential of transistors, there is no need for any additional individual protective circuits for each transistor or additional process steps which additionally increase the outlay for fabricating an integrated semiconductor circuit. Furthermore, it is possible, within an integrated semiconductor circuit, to operate different circuit regions with a different reference-ground potential and a different operating voltage. The potentials of the different circuit regions are completely decoupled from one another. By deliberately influencing the potential difference between the bulk terminal and the remaining terminals of a transistor, it is possible, moreover, to use, even in the circuit regions which are at a higher operating voltage, the circuit elements of the same type which are employed in the remaining circuit regions. This simplifies the configuration and construction process for an integrated circuit.
In a refinement of the invention, the semiconductor circuit has a first operating mode and a second operating mode. In the first operating mode, a first potential of an operating voltage is applied and the output signal of the control circuit has a first reference-ground potential. In the second operating mode, a second potential of an operating voltage is applied, the second potential being higher than the first potential, and the output signal of the control circuit has a second reference-ground potential, which is higher than the first reference-ground potential. Thus, by way of example, if a burning voltage for programming an electrical fuse is applied to the semiconductor circuit in the second operating mode, by virtue of the bulk potential of the NMOS transistor being raised to a suitable extent during the burning operation, the control circuit prevents an excessively high potential difference from occurring across the transistor.
In a development of the invention, the semiconductor circuit or circuit sections thereof can be operated in its or their intended function exclusively in the first operating mode. It contains a differential amplifier, for example. The various configurations of differential amplifiers have, in principle, the same basic circuit of the known type. This contains two input transistors, a current source and an active or passive load. A potential difference between the input signals present at the two input transistors brings about a change in potential at an output of the differential amplifier. The input transistors are embodied using NMOS technology. In comparison with PMOS transistors, these generally have a higher gain and require less space. If an increased input signal or potential of an operating voltage compared with the first operating mode is applied to the control terminal of one of the input transistors in the second operating mode, an increased potential difference between the control terminal and the bulk terminal of the transistor is reduced by the output signal of the control

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