Metal working – Method of mechanical manufacture – Assembling or joining
Reexamination Certificate
2000-09-08
2003-03-11
Vidovich, Gregory M. (Department: 3726)
Metal working
Method of mechanical manufacture
Assembling or joining
C029S404000, C029S423000, C434S072000
Reexamination Certificate
active
06530136
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a method for carrying in and installing a semiconductor manufacturing apparatus in a clean room.
BACKGROUND ART
Apparatuses for manufacturing semiconductor devices are operated in a clean room in which less amount of dust exists. Generally, a device maker (semiconductor device manufacturer) places an order for development and fabrication of a semiconductor manufacturing apparatus with an apparatus maker (manufacturer of semiconductor manufacturing apparatuses). The apparatus maker carries the completed apparatus in a clean room of the semiconductor manufacturing plant or the research center of the device maker, and effects delivery of the apparatus to the device maker after checking the necessary performance. Various processes (operations) are performed according to predetermined procedures after the device maker decides the introduction of the semiconductor manufacturing apparatus and until the device maker starts the operation of the apparatus.
FIG. 1
shows a procedure of a conventional method for introducing or installing a semiconductor manufacturing apparatus. First, the specifications of the semiconductor manufacturing apparatus to be fabricated are created by the device maker and the apparatus maker in consultation with each other (steps D
1
, C
1
, D
2
). At this time, the drawings of the apparatus are also made (step C
2
). Next, the device maker places an order for the apparatus upon decision of the installation position of the apparatus (steps D
3
and D
4
). Upon receipt of the order, the apparatus maker starts fabrication of the apparatus in accordance with the specifications and the drawings (step C
3
). After the order of the apparatus is placed, the device maker arranges with the associated suppliers with respect to engineering works for installing equipments of various utility lines, such as an electricity line, a gas line, an exhaust line, a vacuum line or a cooling water line, around the installation position of the apparatus (step D
5
). Then, after the completion of the fabrication of the apparatus by the apparatus maker, the device maker attends to the performance inspection (step D
6
).
Generally, the semiconductor manufacturing apparatus takes a form of a system in which a processing apparatus having a process chamber (vacuum chamber) for performing a step of a semiconductor manufacturing process is provided as a central core and peripheral devices, such as a target object transportation device or a gas supply device, are provided around the central core. The processing apparatus and the peripheral devices are fabricated as individual units so as to constitute a separable combination system. In the above-mentioned attendance inspection, the system is temporarily constructed by assembling all of the related units so as to test the basic performance as a whole system.
After confirmation and approval are obtained with respect to the performance of the apparatus in the attendance inspection, the apparatus maker settles a schedule for carrying the apparatus in the device maker's site (step C
4
). Then, in order to facilitate the carry-in, the apparatus (system) is disassembled into individual units (step C
5
).
On the other hand, on the device maker side, installation works of the utility equipments are performed in a clean room (step D
7
). In the utility construction, apparatus carry-in route and apparatus installation position are decided in accordance with the drawings of the apparatus, and marking is provided to the floor of the decided apparatus installation position. Then, the utility equipments are established up to the apparatus installation position. That is, various utility lines (pipe, cable) are drawn to positions under the ceiling or above the grating floor in the vicinity of the apparatus installation position. The utility installation works are completed before the date of installation of the apparatus (step D
8
).
The apparatus maker separates or divides the apparatus into individual units and carries the individual units in the clean room of the device maker (step C
6
), and the device maker gathers the individual units at the apparatus installation position so as to assemble the apparatus (step C
7
). After assembling the apparatus, the device maker performs utility connection works so as to connect each utility connection part of the apparatus to the respective utility line (step D
9
). It is normal that such works are performed, after making executing drawings based on the assembled actual apparatus, on an individual utility line basis in accordance with the execution drawings, and, thus, a considerable time period is required. During such a time period, the apparatus maker is on standby (step C
8
).
After all of the utility lines are connected (step D
10
), the apparatus maker performs the checking of the performance of the apparatus, that is, a startup of the apparatus, with the attendance of the device maker (step C
9
). After the startup, the apparatus is transferred from the apparatus maker to the device maker.
As mentioned above, according to the conventional procedures for carrying-in and installing a semiconductor manufacturing apparatus, the utility works performed prior to carrying the apparatus in the clean room are based on the drawings of the apparatus. Accordingly, the utility lines must be ended at positions near the apparatus installation position. Then, after the apparatus is carried in and assembled, the utility line connection works are performed with respect to each utility connection part of the apparatus. Accordingly, the startup of the apparatus is delayed for the period needed to the utility line connection works after the carry-in and installation of the apparatus.
However, it is a device maker's desire to start the operation of the apparatus as early as possible. Additionally, the apparatus maker also desires to complete the delivery by starting the apparatus as early as possible after the carry-in and installation of the apparatus. The period for the utility line connection works is an undesired standby period although it is necessary for both parties. Additionally, the system of the semiconductor manufacturing apparatus tends to be large-scaled, and the number of kinds of utility connection parts increases as the scale of the apparatus system increases. Accordingly, a time (period for works) necessary for the utility line connection works is increased, which results in a further increase in the standby period.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an improved and useful method of carry-in and installation of a semiconductor manufacturing apparatus in which the above-mentioned problems are eliminated.
A more specific object of the present invention is to provide a method of carry-in and installation of a semiconductor manufacturing apparatus, which method reduces a time period from the carry-in of the apparatus to the completion of the connection of the utility lines so as to hasten the startup of the apparatus or the start time of operation of the apparatus.
Another object of the present invention is to provide an apparatus substitute suitable for executing the method of carry-in and installation according to the present invention.
In order to achieve the above-mentioned objects, there is provided according to one aspect of the present invention a method for carrying in and installing a semiconductor manufacturing apparatus in a clean room, the method characterized by:
preparing an apparatus substitute having tentative utility connection parts corresponding to utility connection parts of the semiconductor manufacturing apparatus, the tentative utility connection parts being positioned at substantially the same positions as that of the utility connection parts of the semiconductor manufacturing apparatus;
carrying the apparatus substitute in the clean room and arranging apparatus substitute at a predetermined apparatus installation position;
providing utility lines to the tentative utility connection parts of the
Omgba Essama
Pillsbury & Winthrop LLP
Tokyo Electron Limited
Vidovich Gregory M.
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